Semiconductor News & Analysis Feed
39 articles
2026-06-15
www.digitaltrends.com
2026-06-15
Digital Trends
Making chips smaller has dominated the semiconductor conversation for years, but TSMC’s next big leap may come from how those chips are packaged instead. According to analyst Ming-Chi Kuo, the company is developing a new Chip-on-Panel-on-Substrate, or CoPoS, technology that promises lower manufacturing costs while delivering better performance for future AI processors.
TSMC’s CoPoS packaging coul
2026-06-11
digitimes.com
2026-06-11
Amkor Technology Korea is considering investing about KRW1 trillion (approx. US$650 million) to expand its chip packaging and testing facilities in the South Korean city of Gwangju, according to Korean media reports and city officials. The company has not officially announced the plan.
2026-06-09
www.bnnbloomberg.ca
2026-06-09
BNN Bloomberg
SEOUL, June 9 (Reuters) - Samsung Electronics is considering the construction of an advanced semiconductor packaging facility in the southwestern South Korean city of Gwangju, the Korea Economic Daily said on Tuesday.
Here are some details:
Samsung is expected to unveil the investment plan at a meeting between South Korean President Lee Jae Myung and the heads of the country’s largest conglomera
2026-06-08
digitimes.com
2026-06-08
Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry point into the chip supply chain while wafer fabrication remains a long-term goal. Officials said packaging activities are already underway, as Indian states used Computex in Taipei to attract Taiwanese electronics and AI supply chain investment.
2026-06-05
finance.yahoo.com
2026-06-05
Yahoo Finance
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2026-06-03
www.digitimes.com
2026-06-03
digitimes
Naura Technology Group has shipped its first 600mm × 600mm panel-level packaging descum tool, marking a key step in the Chinese semiconductor equipment maker's move from wafer-level packaging into panel-level packaging, according to ICviews and...
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2026-06-02
news.futunn.com
2026-06-02
富途牛牛
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2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker is hedging its bets with a dual packaging strategy as AI demand strains TSMC's capacity.
2026-05-29
cryptobriefing.com
2026-05-29
Crypto Briefing
MediaTek adopts Intel’s advanced chip packaging alongside TSMC’s services
The chipmaker's dual-sourcing strategy for AI silicon reflects both soaring demand and real capacity bottlenecks at TSMC.
2026-05-29
asia.nikkei.com
2026-05-29
Nikkei Asia
Move a win for US chip titan as it looks to secure customers for foundry services
Mediatek says it is now "one of the few" chip designers able to support customers using advanced packaging technologies from both Taiwan Semiconductor Manufacturing Co. and Intel. (Source photos by Cheng Ting-Fang and Reuters)
TAIPEI -- MediaTek says it has started working with Intel for advanced chip packaging in
2026-05-28
finance.yahoo.com
2026-05-28
Yahoo Finance
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2026-05-26
digitimes.com
2026-05-26
Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions Rio Rancho — its New Mexico site — as a global hub for next-generation packaging production.
2026-05-25
www.techinasia.com
2026-05-25
Tech in Asia
A member of The Business Times. Copyright © 2026 Tech in Asia. All Rights Reserved.
Tata Electronics plans to start chip packaging for global automotive and industrial clients at its new OSAT plant in Jagiroad, Assam, ahead of a wider ramp-up later this year, people familiar with the matter said.
OSAT, or outsourced semiconductor assembly and test, refers to packaging, testing, and inspection af
2026-05-18
www.cxodigitalpulse.com
2026-05-18
CXO Digitalpulse
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2026-05-11
www.tomshardware.com
2026-05-11
Tom's Hardware
Copy linkFacebookXWhatsappRedditPinterestFlipboardEmailShare this article4Join the conversationFollow usAdd us as a preferred source on GoogleNewsletterSubscribe to our newsletterShare prices of both Intel and SK hynix have surged following aZDNet Koreareport claiming that SK is conducting R&D with Intel on 2.5D packaging using Intel's Embedded Multi-die Interconnect Bridge (EMIB) technology, with
2026-05-07
www.digitimes.com
2026-05-07
digitimes
Intel is relocating a data center chip production line from Costa Rica to its Vietnam facility. The move, flagged in a Saigon Hi-Tech Park management board report to the Ho Chi Minh City People's Committee and cited byThe Investorand VN Economy,...The article requires paid subscription.Subscribe Now
2026-05-07
biz.chosun.com
2026-05-07
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Applied Materials buys ASMPT's NEXX to boost panel-level chip packaging
By
Jeong Du-yong
Published 2026.05.07. 10:08
/Courtesy of Applied Materials
Semiconductor equipment corporations Applied Materials said on the 7th that it signed a definitive agreement with ASMPT to acqui
2026-05-06
247wallst.com
2026-05-06
24/7 Wall St.
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2026-05-04
www.reuters.com
2026-05-04
Reuters