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Samsung Electronics is preparing to expand its foundry push into physical AI semiconductors through a chiplet platform developed with Cadence, targeting chips for robotics, automotive systems, drones, and industrial automation, ETNewsreported, citing industry sources.

By Allen Lee Published: May 27 2026, 11:33 AM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket SAMSUNG.COM Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals

By Allen Lee Published: May 27 2026, 11:33 AM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard Share on Pocket SAMSUNG.COM Samsung Foundry plans to tape out its Physical AI chiplet platform with design partner Cadence Design Systems in early 2027, with volume production of commercial chips targeted for the second half of that year — a move that signals

Samsung may launch a Physical AI chiplet platform next year in collaboration with Cadence. The platform could support applications like robotics, autonomous driving, and industrial automation. It is being developed using the Korean foundry’s SF5A (5nm) process technology. In January 2026, Samsung and Cadence announced a partnership to develop a chiplet-based Physical AI semiconductor platform. Un