Semiconductor News & Analysis Feed

892 articles
2026-06-26
apnews.com 2026-06-26 AP News
A shopper looks over Apple MacBook laptops on display in a Costco warehouse on June 2, 2026, in Sheridan, Colo. (AP Photo/David Zalubowski, File) Apple on Thursday announced an increase in prices for Macs and iPads, citing a memory chip shortage brought on by the artificial intelligence boom. The Cupertino, California-based company called the demand spike an “unprecedented challenge” for the con
2026-06-26
hothardware.com 2026-06-26 HotHardware
IBM Just Shattered Moore's Law With Sub-1 Nanometer Chips by Zak Killian — Thursday, June 25, 2026, 01:55 PM EDT Comments IBM today announced what it calls the world's first sub-1 nanometer chip technology, unveiling a new 0.7nm (7 angstrom) semiconductor process built around an entirely new transistor architecture dubbed "nanostack." The announcement is significant not only because it pushes se
2026-06-26
www.androidauthority.com 2026-06-26 Android Authority
Affiliate links on Android Authority may earn us a commission. Learn more. Only a few years back, we were still looking forward to smartphone chips manufactured on a 2nm process as the next big thing. Fabrication advancements have now made 2nm chips a reality — so what’s next? Engineers have already been pushing the limits of physics for a while now, and although they’re probably going to come up
2026-06-26
www.investors.com 2026-06-26 Investor's Business Daily
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2026-06-25
www.foreignpolicyjournal.com 2026-06-25 foreignpolicyjournal.com
Qualcomm (NASDAQ: QCOM) is making an aggressive push into the AI data center market, unveiling a broad range of new products including AI accelerators, CPUs, memory technology, and software. The company has already secured deals with major customers, including Microsoft (NASDAQ: MSFT) and Meta (NASDAQ: META), with Meta signing a multigeneration agreement to deploy Qualcomm’s new Dragonfly C1000 C
2026-06-25
www.techzine.eu 2026-06-25 Techzine Global
3 MIN DEVICES Sovereign European chips could become a RISC-V-based reality SUSE and Openchip Join Forces ERIK VAN KLINKEN Jun 25, 2026, 11:00 PM GMT+8 A sovereign IT infrastructure is open to interpretation. Only the American hyperscalers consider data residency sufficient to call an IT stack sovereign. Rarely, however, is the physical hardware discussed: how autonomous are you if your chips come
2026-06-25
qz.com 2026-06-25 qz.com
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2026-06-25
www.manilatimes.net 2026-06-25 The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
bits-chips.com 2026-06-25 Bits&Chips
Headline Japanese researcher proposes simpler high-NA EUV optics design 25 June 2026 Paul van Gerven Editor at Bits&Chips Reading time: 1 minute A researcher at the Okinawa Institute of Science and Technology (OIST) has proposed a new optical architecture for high-NA EUV lithography. The approach replaces today’s highly complex optical layouts with a simpler in-line configuration that uses carefu
2026-06-25
www.marketscreener.com 2026-06-25 marketscreener.com
Access Denied You don't have permission to access "http://www.marketscreener.com/news/applied-materials-introduces-new-systems-to-accelerate-dram-and-advanced-packaging-for-ai-chips-ce7f5fd8de89f521" on this server. Reference #18.e5ab3717.1782397979.215a9cd https://errors.edgesuite.net/18.e5ab3717.1782397979.215a9cd
2026-06-25
www.globenewswire.com 2026-06-25 GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
finance.yahoo.com 2026-06-25 Yahoo Finance
This is a paid press release. Contact the press release distributor directly with any inquiries. Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips Applied Materials, Inc. Thu, June 25, 2026 at 6:00 AM PDT 6 min read AMAT -3.33% Trade AMAT on Coinbase Trading disclosure Applied Materials, Inc. Innovations spanning DRAM and advanced packaging enable the
2026-06-25
news.google.com 2026-06-25 Stock Titan
2026-06-25
tomshardware.com 2026-06-25 Luke James
Qualcomm has announced that it will bring all four of its Dragonfly data center product lines to China.
2026-06-25
www.forbes.com 2026-06-25 Forbes
INNOVATION AI Whoever Wins AI Will Count Transformers, Not Nvidia Chips ByRobert J. Szczerba, Contributor. Robert J. Szczerba is a tech CEO covering AI, robotics and automation Follow Author Jun 25, 2026, 06:15am EDT Summary The US AI buildout faces a critical bottleneck: not chips, but power infrastructure. Half of planned 2026 data centers are stalled due to shortages of transformers, switc
2026-06-25
eetimes.com 2026-06-25
IBM unveils 0.7-nm nanostack chips promising 100 billion transistors, denser SRAM, and production within five years.
2026-06-25
www.reuters.com 2026-06-25 Reuters
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2026-06-25
www.bloomberg.com 2026-06-25 Bloomberg
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2026-06-25
digitimes.com 2026-06-25
OpenAI on June 24 unveiled "Jalapeño," its first in-house AI accelerator, co-developed with Broadcom and manufactured by TSMC — the clearest sign yet that leading model developers want to design their own chips and broaden a supply chain long dominated by Nvidia.
2026-06-25
digitimes.com 2026-06-25
Samsung Electronics chairman Lee Jae-yong visited the company's Cheonan plant on June 23 to review high-bandwidth memory production operations, as cumulative revenue from the company's latest HBM generation has crossed the US$1 billion mark and demand tied to AI chips continues to rise.