Semiconductor News & Analysis Feed
228 articles
2026-07-12
digitimes.com
2026-07-12
The rapid expansion of AI servers and large language models (LLMs) is driving unprecedented demand for data center computing, making high-speed interconnect technologies one of the next major battlegrounds in AI infrastructure.
2026-07-11
finance.biggo.com
2026-07-11
finance.biggo.com
2026-07-11
digitimes.com
2026-07-11
South Korean AI semiconductor startup Mobilint is gaining traction in physical AI with its neural processing units (NPU) for edge devices, as the AI boom spreads from cloud computing into robots, autonomous vehicles and drones. Mobilint CEO Shin Dong-joo (transliterated from Korean) and other industry figures say the next two to three years will be a crucial window for South Korea to capture the p
2026-07-10
digitimes.com
2026-07-10
Meta Platforms plans to begin manufacturing its Iris AI accelerator in September 2026 while securing long-term supplies of memory, storage and optical equipment for a computing expansion expected to reach 14 gigawatts in 2027.
2026-07-10
digitimes.com
2026-07-10
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI), high-performance computing (HPC), data centers, and advanced memory demand are reshaping semiconductor sourcing. The deal extends US supply chain localization beyond wafer production and into upstream critical material
2026-07-10
www.qualcomm.com
2026-07-10
Qualcomm
2026-07-09
digitimes.com
2026-07-09
Aurona Industries said demand for its PCB process materials remains strong, with order intake rising year over year, and high-end products in particular are seeing robust traction. The company's update reflects continued momentum for global electronics supply chains, as AI-related upgrades and high-speed computing fuel broader demand across Asia.
2026-07-09
digitimes.com
2026-07-09
Analog Devices (ADI) announced that it has completed its acquisition of Empower Semiconductor, a move it said is designed to bolster the company's role as a comprehensive power partner spanning the entire AI ecosystem, from grid infrastructure to core computing systems.
2026-07-09
digitimes.com
2026-07-09
CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade 17nm production, expand DDR5, and develop HBM for AI servers and high-performance computing.
2026-07-09
digitimes.com
2026-07-09
Chang Wah Technology Co. said its June and second quarter revenue both reached all-time highs in 2026, supported by rising demand from data centers, high-performance computing and automotive electronics. The Taiwan-based lead frame maker said stronger demand for power management and microcontroller products helped drive the latest gains.
2026-07-09
semiengineering.com
2026-07-09
Bryon Moyer
It's slowly emerging from research and heading toward high-volume production.
2026-07-08
finance.yahoo.com
2026-07-08
Yahoo Finance
2026-07-08
news.google.com
2026-07-08
Business Wire
2026-07-08
digitimes.com
2026-07-08
A Chinese research team has developed a phase-change memristor-based neural dynamical system chip, offering a potential hardware path for real-time brain modeling, brain-computer interfaces, and brain disease diagnosis.
2026-07-07
finance.yahoo.com
2026-07-07
Yahoo Finance
Nvidia Corp. (NVDA) Announces a Profit-Sharing Program For Its Computing Framework Access
Muhammad Ali Khalid
Tue, July 7, 2026 at 7:15 AM PDT 2 min read
NVDA
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On July 1, Nvidia Corp. (NASDAQ:NVDA) disclosed a profit-sharing program developed to give model builders, AI
2026-07-07
digitimes.com
2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
digitimes.com
2026-07-07
As generative AI drives rapid growth in high-performance computing (HPC) demand, the semiconductor industry is shifting from process-node competition to materials competition. Geckos chairman Raymond Shen said that once chip manufacturing advances to 2nm and beyond, improvements in AI computing power are no longer just a chip-design issue, but are increasingly constrained by materials' heat dissip
2026-07-07
www.digitimes.com
2026-07-07
digitimes
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
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2026-07-06
news.google.com
2026-07-06
Yahoo Finance
2026-07-06
news.google.com
2026-07-06
Yahoo! Finance Canada