Semiconductor News & Analysis Feed
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2026-06-02
blogs.cisco.com
2026-06-02
Cisco Blogs
June 2, 2026
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Artificial Intelligence - AI
AI Security Everywhere: Cisco AI Defense on NVIDIA Accelerated Computing
2 min read
Sriram Sagi
Enterprises don’t get to choose one cloud, one GPU, or one deployment model for AI. They’re running inference across the full NVIDIA accelerated computing family — from production clusters to proof-of-value labs and everything in between. They
2026-06-01
www.semafor.com
2026-06-01
Semafor
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2026-06-01
seekingalpha.com
2026-06-01
Seeking Alpha
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2026-06-01
wccftech.com
2026-06-01
Wccftech
NVIDIA's GTC Taipei 2026 keynote is just a few hours away, and CEO Jensen Huang will be presenting the latest, including a brand new platform for PCs.
Well, the day is finally here, and in just a few hours, NVIDIA will be hosting its annual GTC Taipei event in Taiwan, where the company is expected to unveil brand new technologies and a big surprise for the PC segment.
In what is arguably the big
2026-06-01
simplywall.st
2026-06-01
simplywall.st
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2026-05-31
digitimes.com
2026-05-31
Nan Ya Plastics announced at its May 29 shareholders meeting that it would pivot into three new business areas — medical materials, semiconductor materials, and comprehensive power solutions — as part of a broader transformation planned for 2026 and 2027. Chairman Chia-Chau Wu said the move aims to raise the share of electronic materials in group revenue from just over 50% today to about 60% by 20
2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
Unimicron said it will push advanced substrate and AI system-board upgrades in 2026 to capture accelerating demand for AI-related ASICs and switches, aiming for record revenue that would exceed its 2022 peak. The IC substrate and printed circuit board maker announced the strategy at its annual shareholders' meeting at the end of May, citing a shift in demand away from GPUs and CPUs toward ASICs, s
2026-05-29
digitimes.com
2026-05-29
Arm EVP and Chief Commercial Officer Will Abbey visited QBit Semiconductor's Taiwan headquarters on May 27, signaling deeper cooperation that could shape future chip design for edge AI, physical AI, and quantum-computing cybersecurity. The visit highlights how platform alliances are increasingly influencing next-generation computing architectures for global technology markets.
2026-05-29
www.technetbooks.com
2026-05-29
Technetbook
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Intel Fellow Ravi Mahajan on how EMIB and Advanced Packaging Drive Modern AI Computing
Intel Foundry Advanced Packaging Evolution and EMIB Development for Artificial Intelligence Workloads and Future Semiconductor Architecture Solutions
The semiconductor industry is at a turning point where shrinking transistors is no longer sufficient to support the massive computational power needed
2026-05-28
digitimes.com
2026-05-28
Shiny Chemical Industrial said demand for its electronic-grade products is being driven mainly by advanced semiconductor processes, AI, and high-performance computing, with its share of revenue continuing to rise. The company has begun expanding capacity for its electronic-grade isopropyl alcohol (IPA) and propylene glycol methyl ether (PM) lines.
2026-05-28
digitimes.com
2026-05-28
China has brought AI chips into its national security and reliability evaluation framework for the first time, turning what looks like a product certification process into something more consequential: an emerging gatekeeping system for AI computing infrastructure.
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com
2026-05-28
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board
2026-05-28
digitimes.com
2026-05-28
South Korean AI chip startup FuriosaAI has announced a partnership with Broadcom to develop a next-generation AI inference platform aimed at large-scale agentic AI deployments, as demand grows for infrastructure optimized for AI reasoning and high-volume inference workloads.
2026-05-27
digitimes.com
2026-05-27
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into a more critical front for HBM suppliers.
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
digitimes.com
2026-05-27
China has formally brought AI chips into its national security and reliability evaluation framework for the first time, marking a further expansion of the country's Information Technology Application Innovation procurement policy into AI computing infrastructure.
2026-05-27
eetimes.com
2026-05-27
Gary Hilson
University of Saskatchewan will leverage quantum computing for health, defense, energy, and agriculture research.