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2026-06-23
chargedevs.com
2026-06-23
Charged EVs
chargedevs.com
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2026-06-23
www.mitsloanme.com
2026-06-23
MIT Sloan Management Review Middle East
Nvidia’s New Cooling System Cuts Data Center Water Use to Near Zero—But Not AI’s
The technology addresses on-site consumption, while power generation and chip manufacturing remain major contributors.
MITSloan ME Editorial
18 hours ago
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Data, AI, & Machine Learning
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Oracle Cuts 21,000 Jobs as AI Silently Reshapes Its Operating Model
Nvidia
2026-06-23
tomshardware.com
2026-06-23
Jowi Morales
This system raises the base coolant temperature to 113 degrees F (45 degrees C) to save on electricity costs and reduce water consumption to basically zero.
2026-06-23
www.tomshardware.com
2026-06-23
Tom's Hardware
Tech Industry Data Centers
Nvidia announces liquid cooling system that runs ‘hotter than a hot tub’ — promises to reduce electricity consumption and cut water use by up to 100%, but sustainability challenges remain
News
By Jowi Morales published 23 hours ago
Data centers are about to go from freezing to sweltering.
(Image credit: Getty Images)
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2026-06-23
www.indexbox.io
2026-06-23
IndexBox
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2026-06-23
digitimes.com
2026-06-23
Industrial gas manufacturer Nippon Sanso Holdings announced it will raise prices for all helium products in the Japanese market starting in July 2026, with an average price increase of more than 30%. Affected products include helium used in key applications such as semiconductor front-end process wafer cooling and medical magnetic resonance imaging (MRI) equipment. The move is mainly driven by geo
2026-06-22
cryptobriefing.com
2026-06-22
Crypto Briefing
Nvidia claims AI’s water challenge is largely solved with new cooling tech
The chipmaker says its next-gen liquid cooling systems achieve 300x water efficiency, but experts aren't ready to declare victory
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Editorial Team
Jun. 22, 2026
Nvidia is making a sweeping claim: the water problem plaguing AI data centers is basically handled. A top executive at the company says its
2026-06-22
www.techbuzz.ai
2026-06-22
The Tech Buzz
NVIDIA just turned conventional data center wisdom on its head. The chip giant's latest AI servers can run liquid cooling systems at 45°C (113°F) - hotter than your average hot tub and significantly warmer than industry norms. The counterintuitive move isn't about tolerating heat, it's about harnessing it. By pushing cooling temperatures higher, NVIDIA's creating a new playbook for energy efficien
2026-06-22
digitimes.com
2026-06-22
Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into AI cooling, semiconductors, and drones. The company's liquid-cooling cold plates for AI applications have already been sampled by end customers and are expected to begin shipping in the second half of 2026. Once volume
2026-06-22
www.digitimes.com
2026-06-22
digitimes
Amid growing localization efforts across China's supply chain, FineMat Applied Materials has seen its metal mask business continue to shrink and is accelerating its transition into AI cooling, semiconductors, and drones. The company's liquid-cooling cold...
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2026-06-17
digitimes.com
2026-06-17
Driven by Nvidia and other tech giants, global AI data center buildouts are undergoing an unprecedented structural shift. The pressure is not only coming from explosive compute demand, but also from upgrades in power, cooling, and supply-chain resilience.
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
The legendary air cooling company is diving into water (cooling).
2026-06-16
techxplore.com
2026-06-16
Tech Xplore
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2026-06-14
tomshardware.com
2026-06-14
Jowi Morales
Amazon says that it uses 2.5 billion gallons of water annually for data center cooling but compares it to the 3.3 trillion gallons of water used for watering lawns and gardens in the U.S. every year.
2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
ROHM has developed the TSC3PAK, a top-side cooling package for SiC MOSFETs aimed at high-voltage power conversion in electric vehicles and industrial systems. The 14.00 × 18.58 × 3.50 mm surface-mount package is designed to combine automated mounting with heat dissipation closer to conventional through-hole packages such as TO-247-4L.
2026-06-12
digitimes.com
2026-06-12
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
2026-06-11
www.automotivepowertraintechnologyinternational.com
2026-06-11
Automotive Powertrain Technology International
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, enabling automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliabi
2026-06-10
www.semiconductor-today.com
2026-06-10
Semiconductor Today
ROHM has developed the TSC3PAK (14.00mm x 18.58mm x 3.50mm) package for silicon carbide (SiC) MOSFETs. Mass production began in June.
Picture: ROHM’s new top-side-cooling package for SiC MOSFETs.
By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performa
2026-06-10
www.manilatimes.net
2026-06-10
The Manila Times
KYOTO, Japan, June 10, 2026 /PRNewswire/ -- ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm) package for SiC MOSFETs. By adopting a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, the new product enables automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (
2026-06-10
digitimes.com
2026-06-10
GEM Terminals reported consolidated revenue of about NT$428 million (US$13.6 million) in May 2026, up 71.83% year-over-year from NT$249 million, saying expanding global investment in AI infrastructure drove a surge in demand for specialty copper materials used in cooling applications. The firm linked the month's performance to rising cooling needs at servers and data centers as computing density i