Semiconductor News & Analysis Feed

849 articles
2026-05-29
www.morningstar.com 2026-05-29 Morningstar
Home News PR Newswire Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest Samsung Foundry Processes at SAFE Forum 2026 Provided by PR Newswire May 29, 2026, 1:00:00 AM Synopsys Advances Power and Performance for AI and Multi-Die Designs on Latest S
2026-05-29
www.investing.com 2026-05-29 Investing.com
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2026-05-29
economictimes.indiatimes.com 2026-05-29 The Economic Times
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2026-05-29
www.reuters.com 2026-05-29 Reuters
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2026-05-29
www.channelnewsasia.com 2026-05-29 CNA
Business Energy use forcing rethink of AI chip design, TSMC says FILE PHOTO: The logo of Taiwan Semiconductor Manufacturing Company (TSMC) is displayed at TSMC Museum of Innovation in Hsinchu, Taiwan April 9, 2026. REUTERS/Ann Wang/File Photo 29 May 2026 12:18AM Bookmark WhatsApp Telegram Facebook Twitter Email LinkedIn Set CNA as your preferred source on Google Add CNA as a trusted source to
2026-05-29
finance.yahoo.com 2026-05-29 Yahoo Finance
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2026-05-29
news.google.com 2026-05-29 U.S. News Money
2026-05-29
www.marketscreener.com 2026-05-29 marketscreener.com
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2026-05-29
www.marketscreener.com 2026-05-29 marketscreener.com
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2026-05-28
news.google.com 2026-05-28 Business Wire
2026-05-28
eetimes.com 2026-05-28
AI in design verification no longer asks if AI helps tasks, but does it measurably improve real verification flows?
2026-05-28
finance.yahoo.com 2026-05-28 Yahoo Finance
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2026-05-28
sg.finance.yahoo.com 2026-05-28 Yahoo Finance Singapore
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2026-05-28
news.siemens.com 2026-05-28 Siemens
Siemens today announced the latest continued collaboration with Samsung Foundry, reinforcing joint efforts to enable advanced semiconductor design and manufacturing workflows for the global fabless ecosystem. Through close engineering alignment, Siemens continues to qualify and deploy its electronic design automation (EDA) software - including design, verification, simulation and silicon manufact
2026-05-28
www.tomshardware.com 2026-05-28 Tom's Hardware
Tech Industry Manufacturing Semiconductors Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management News By Luke James published 20 minutes ago China now has a prototype tool designed for vertical circuit stacking. (Image credit: Getty Images) Share this article 0 Join the conversatio
2026-05-28
tomshardware.com 2026-05-28 Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.
2026-05-28
www.investing.com 2026-05-28 Investing.com
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2026-05-28
ca.investing.com 2026-05-28 Investing.com Canada
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2026-05-28
news.google.com 2026-05-28 MarketBeat
2026-05-28
www.marketbeat.com 2026-05-28 MarketBeat
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