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dorsaVi has completed the design of its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip, marking a significant step forward in its ultra-edge intelligence roadmap. Developed in collaboration with NTU Singapore and ITRI Taiwan, the c

dorsaVi has completed the design of its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip, marking a significant step forward in ultra-edge AI applications. Developed in collaboration with NTU Singapore and ITRI Taiwan, the chip uses

dorsaVi (ASX:DVL) announced the completion of its first integrated RRAM-CMOS validation chip design on June 18, 2026, leading to a 2.50% stock gain to AUD 0.041. Developed in collaboration with NTU Singapore and ITRI Taiwan, the chip marks a significant step toward commercializing ultra-edge intelli

dorsaVi (ASX:DVL) has completed the full design package for its first integrated RRAM-CMOS validation chip, marking a significant step from roadmap to silicon. Developed in collaboration with NTU Singapore and ITRI Taiwan, the chip uses TSMC’s standard CMOS wafers with RRAM layers added in the back-