Semiconductor News & Analysis Feed

dorsaVi (ASX: DVL) has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip. The company has developed the chip with NTU Singapore and ITRI Taiwan, and is now ready to move into tape-out and staged silicon implementation. The design incorporates self-checking write-and-verify circuitry, compute-in

Highlights dorsaVi shares rose 2.50% to AUD 0.041 on 18 June 2026, following the release of latest operational update. The company finalised the design package for its first integrated RRAM-CMOS validation chip. The chip was developed with NTU Singapore and ITRI Taiwan. The program now moves toward tape-out and staged silicon implementation. Key features include write-and-verify circuitry, Comput

Tape-out clears the path to validation data, with compute-in-memory and TSMC-sourced wafers framing the commercial pitch dorsaVi (ASX:DVL) has reached the moment its RRAM equity story has been pointing toward for the better part of two years. The company has finalised the full design package for its first integrated RRAM-CMOS validation chip, developed alongside NTU Singapore and ITRI Taiwan, and