Semiconductor News & Analysis Feed
872 articles
2026-06-17
www.constellationr.com
2026-06-17
Constellation Research
HPE tightens Nvidia ties in AI stack, integrates Juniper
PUBLISHED JUNE 16, 2026
HPE launched an updated AI factory stack on the latest Nvidia technologies including the Vera CPU, added features to HPE Private Cloud AI and integrated the Juniper networking portfolio as part of its self-driving network strategy.
The barrage landed as HPE Discover kicked off in Las Vegas. HPE delivered strong earn
2026-06-16
tomshardware.com
2026-06-16
Luke James
SemiAnalysis has published the first teardown from its new in-house lab, focusing on the minimum local metal pitch on SMIC’s third-gen 7nm at 32.5nm.
2026-06-16
www.theglobeandmail.com
2026-06-16
The Globe and Mail
Lam Research Corporation’s LRCX advanced packaging business is emerging as an important growth driver. With artificial intelligence (AI) driving major changes in chip design, this business could become a meaningful catalyst for future growth.
Unlike traditional semiconductor manufacturing, AI chips require advanced packaging techniques to connect multiple processors and memory components in a com
2026-06-16
www.theglobeandmail.com
2026-06-16
The Globe and Mail
Lam Research Corporation’s LRCX advanced packaging business is emerging as an important growth driver. With artificial intelligence (AI) driving major changes in chip design, this business could become a meaningful catalyst for future growth.
Unlike traditional semiconductor manufacturing, AI chips require advanced packaging techniques to connect multiple processors and memory components in a com
2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
This is a paid press release. Contact the press release distributor directly with any enquiries.
Advanced Packaging Market Size to Worth $106.71 Billion by 2035 | Research by SNS Insider
SNS Insider pvt ltd
Tue, 16 June 2026 at 6:30 am GMT-7 6 min read
SNS Insider pvt ltd
The U.S. Advanced Packaging Market is estimated to be USD 9.66 Billion in 2025 and is projected to reach USD 21.67 Billion by
2026-06-16
www.tradingview.com
2026-06-16
TradingView
News
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Zacks
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Lam Research Expects Packaging Growth of 50%: Is It a Hidden Catalyst?
Lam Research Expects Packaging Growth of 50%: Is It a Hidden Catalyst?
3 min read
LRCX
−5.03%
Lam Research Corporation’s LRCX advanced packaging business is emerging as an important growth driver. With artificial intelligence (AI) driving major changes in chip design, this business could become a meaningful cata
2026-06-16
www.zacks.com
2026-06-16
Zacks Investment Research
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In ad
2026-06-16
tomshardware.com
2026-06-16
Sarah Jacobsson Purewal
I test keyboards for a living, and these are the keyboards I keep coming back to.
2026-06-16
tomshardware.com
2026-06-16
Bruno Ferreira
Oracle's Project Jupiter is targeting a New Mexico desert already struggling with water consumption, but the company assures residents that the data center's water usage is "negligible."
2026-06-16
www.thelec.net
2026-06-16
thelec.net
Genesem's Veloce G7 saw singulation equipment. (Photo: Genesem)
Genesem will supply semiconductor equipment, including saw singulation systems, worth about 7.37 billion won to SK hynix.
The company disclosed on June 15 that it signed a semiconductor back-end equipment supply contract with SK hynix's Chongqing subsidiary in China. The contract value is about 7.37 billion won, equivalent to roughl
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Lam Research, US5128071082
AI wafer demand lifts Lam Research’s Sense.i platform into the spotlight
16.06.2026 - 10:44:18 | ad-hoc-news.de
Lam Research’s Sense.i etch platform is emerging as one of the key workhorses for high-aspect-ratio 3D NAND and advanced logic, as chipmakers ramp AI data center capacity and high-bandwidth memory. The modular system targets lower cost per wafer and tighter pr
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
2026-06-16
digitimes.com
2026-06-16
After Apple's WWDC 2026 keynote, online rumors claimed that only premium devices with 12GB of memory could run on-device AI, but DIGITIMES analyst Luke Lin said on a podcast that that was just Apple's messaging. Most on-device AI features only need 8GB of memory; only the Apple-defined advanced on-device AI requires the higher 12GB spec.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
Shanghai Enflame Technology is nearing a STAR Market listing, bringing another Chinese AI chipmaker closer to public markets while losses, Tencent concentration, and a small share in Nvidia-led accelerators remain unresolved.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
South Korea has begun planning a large-scale research and development program for next-generation power semiconductors as part of its broader "Ultra-Innovation Economy Project," according to a report by the Seoul Economic Daily.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly
2026-06-16
digitimes.com
2026-06-16
Samsung Electronics has secured key technology for a 5nm-class magnetoresistive random-access memory cell, according to Korean financial daily Sedaily, moving ahead just four months after presenting what it described as the world's first 8nm-class MRAM at an international conference.