Semiconductor News & Analysis Feed
62 articles
2026-06-08
finance.yahoo.com
2026-06-08
Yahoo Finance
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2026-06-05
www.newelectronics.co.uk
2026-06-05
New Electronics
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Neil Tyler
05 Jun 2026
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Automotive
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Technology
Cambridge GaN Devices’ 650V GaN IC to improve EV powertrain efficiency
Product Launches
1 min read
Cambridge GaN Devices (CGD) has developed a 650V gallium nitride (GaN) integrated circuit designed for automotive applications, aimed at improving inverter efficiency in electric vehicles
2026-06-03
bioengineer.org
2026-06-03
Bioengineer.org
In a groundbreaking advancement poised to redefine the future of electronics cooling and energy efficiency, researchers have developed an innovative hybrid energy generator (HEG) that harnesses waste heat from electronic devices and converts it into usable electrical energy. This novel technology integrates a cellulose-based aerogel precursor with meticulously engineered electrode structures to of
2026-06-02
evertiq.com
2026-06-02
Evertiq
© STMicroelectronics
General | June 02, 2026
STM’s new GaN semiconductors improve energy efficiency
Evertiq
STMicroelectronics’ new PowerGaN devices deliver high efficiency and power density to high-voltage power supplies. Engineered for a 700V operating rating, they support reliable high-power operation and higher-frequency topologies.
New gallium nitride (GaN)-based power semiconductors from ST
2026-06-02
developer.nvidia.com
2026-06-02
NVIDIA Developer
As AI agents move from the digital world to the physical environment, they can readily use NVIDIA Jetson to accelerate real-world deployment with optimized memory and performance.
NVIDIA JetPack 7.2 directly supports one-command deployment of NVIDIA NemoClaw, an open source stack that adds privacy and security controls to OpenClaw. It introduces NVIDIA agent skills for Jetson—Jetson device-side
2026-06-02
developer.nvidia.com
2026-06-02
NVIDIA Developer
As AI agents move from the digital world to the physical environment, they can readily use NVIDIA Jetson to accelerate real-world deployment with optimized memory and performance.
NVIDIA JetPack 7.2 directly supports one-command deployment of NVIDIA NemoClaw, an open source stack that adds privacy and security controls to OpenClaw. It introduces NVIDIA agent skills for Jetson—Jetson device-side
2026-06-02
eetimes.com
2026-06-02
Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.
2026-06-01
tomshardware.com
2026-06-01
Jeffrey Kampman
Unusual memory choice brings lots of AI data closer to the chip for efficiency
2026-06-01
www.inkworldmagazine.com
2026-06-01
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2026-05-31
simplywall.st
2026-05-31
simplywall.st
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2026-05-31
www.tweaktown.com
2026-05-31
TweakTown
TSMC says energy efficiency has overtaken raw performance as the top priority for AI chip customers
TSMC's A14 process targets 20% better performance and 30% lower power than N2, as the industry shifts focus from transistor density to energy efficiency.
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Hassam Nasir
Tech Reporter
Published May 30, 2026 7:30 PM CDT
2 minutes & 15 seconds read time
TL;DR: TSMC highlights energy effi
2026-05-30
tomshardware.com
2026-05-30
Kunal Khullar
Intel's next-generation 12V-only PSU standard reportedly adds PMBus support, smaller connectors, and improved power efficiency.
2026-05-29
sg.finance.yahoo.com
2026-05-29
Yahoo Finance Singapore
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
digitimes.com
2026-05-29
As AI moves from cloud environments into factories and physical systems, semiconductor design is being reshaped by new demands in speed, energy efficiency, and on-site learning. At a recent system-semiconductor seminar in South Korea, Seong-jun Jang, a research center director at the Korea Electronics Technology Institute (KETI), outlined four key architectural directions for future AI chips aimed
2026-05-29
digitimes.com
2026-05-29
Generative AI, HPC, and large data centers are raising demand for chips with higher power efficiency, stronger thermal control, and denser packaging, making advanced packaging a more strategic part of the semiconductor supply chain. In China, panel-level packaging (PLP) is gaining traction for its larger format, higher output, and lower-cost potential.
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
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2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-27
eetimes.com
2026-05-27
This paper explores how configurable and intelligent I/O technologies are transforming industrial control systems by enabling greater flexibility, improved thermal performance, and higher system uptime. Traditional fixed-function I/O architectures, while effective in stable environments, create inefficiencies through SKU proliferation, underutilized channels, and limited adaptability to late-stage
2026-05-27
www.newelectronics.co.uk
2026-05-27
New Electronics
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Neil Tyler
27 May 2026
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STMicroelectronics introduces 700V GaN devices to improve power efficiency
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STMicroelectronics has launched a new range of gallium nitride (GaN)-based power semiconductors aimed at improving energy efficiency and power dens