Semiconductor News & Analysis Feed
460 articles
2026-06-18
www.newelectronics.co.uk
2026-06-18
New Electronics
www.newelectronics.co.uk
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2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics and SK Hynix are each reviewing locations in South Korea's Honam region for new semiconductor packaging plants, according to The Elecand Hankyung, citing industry sources, as the two companies look for ways to add back-end capacity beyond their existing manufacturing hubs.
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics is reportedly working with multiple partners to develop production equipment for its seventh-generation 10nm-class (1d) DRAM process. The company aims to begin tool installation as early as the second quarter of 2027, with initial volume production expected by the end of that year.
2026-06-18
digitimes.com
2026-06-18
Taiwan's electronics industry is stepping up its global ambitions as AI, data center infrastructure, and advanced manufacturing reshape supply chains. Speaking at the Chinese National Association of Industry and Commerce (CNAIC) on June 18, 2026, Foxconn chairman and Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) chairman Young Liu outlined a strategy that combines overseas in
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay for a full wafer run, according to ZDNet Koreaand iNews24.
2026-06-18
www.thelec.net
2026-06-18
thelec.net
ISTE's FOUP cleaner for HBM back-end processes. (Photo: ISTE)
ISTE announced on June 17 that it has received an initial order from Samsung Electronics for front-opening unified pod (FOUP) cleaning equipment designed for high-bandwidth memory (HBM) manufacturing. The deal adds Samsung to ISTE's customer base alongside SK hynix.
FOUP cleaners are used to remove contaminants from the sealed carrier
2026-06-17
www.ad-hoc-news.de
2026-06-17
AD HOC NEWS
Aixtron, DE000A0WMPJ6
Why Aixtron’s AIX G10-SiC could quietly reshape power electronics
17.06.2026 - 10:12:21 | ad-hoc-news.de
Aixtron’s AIX G10-SiC is a production-scale MOCVD system for silicon carbide power devices that targets efficiency and cost per wafer rather than flashy specs. What makes the tool interesting for chip makers - and where are the limits?
Aixtron, DE000A0WMPJ6
Reviewed: ad
2026-06-17
www.electronicsweekly.com
2026-06-17
Electronics Weekly
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2026-06-17
www.electronicsforyou.biz
2026-06-17
Electronics For You BUSINESS
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2026-06-17
www.winchesterstar.com
2026-06-17
The Winchester Star
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2026-06-17
norfolkdailynews.com
2026-06-17
The Norfolk Daily News
Future Electronics is highlighting an upcoming webinar from onsemi titled "Intelligent Sensing and Power Solutions for Drones that Must Sense, Decide, and Act Autonomously," taking place on Thursday, June 25, 2026, from 10:00 AM to 11:00 AM CDT.
Montreal, Canada - June 16, 2026 - As drone technology continues to advance, the industry is rapidly moving toward Physical AI systems capable of real-ti
2026-06-17
www.laconiadailysun.com
2026-06-17
The Laconia Daily Sun
Yard Sale Map
2026-06-17
markets.financialcontent.com
2026-06-17
FinancialContent
Future Electronics Features onsemi Webinar on Intelligent Sensing and Power Solutions for Autonomous Drones
By:
Get News
June 16, 2026 at 22:12 PM EDT
ⓘ This article is third-party content and does not represent the views of this site. We make no guarantees regarding its accuracy or completeness.
Future Electronics is highlighting an upcoming webinar from onsemi titled "Intelligent Sensing and Pow
2026-06-17
digitimes.com
2026-06-17
Nvidia is expected to surpass Apple and Samsung Electronics' mobile division to become the world's top buyer of LPDDR, as AI servers and AI PCs pull low-power memory beyond smartphones, MoneyTodayreported, citing electronics industry sources.
2026-06-17
digitimes.com
2026-06-17
Global chip buyers, including BYD, Google, AMD, and Tesla, are turning to Samsung Electronics as TSMC's advanced production lines remain fully booked, Nikkei Asiareported. The shift underscores how AI demand and supply-chain risk are reshaping where cutting-edge chips are made.
2026-06-17
digitimes.com
2026-06-17
Semiconductor materials suppliers are moving to rebuild depleted inventories and recover sharply higher costs from Samsung Electronics, SK Hynix and other memory chip customers after the 106-day US-Iran war strained supply chains for precursors, specialty gases and other key chipmaking inputs.
2026-06-17
www.quiverquant.com
2026-06-17
Quiver Quantitative
United Microelectronics Corporation (UMC) is down 6.3% today. Here is some analysis on what might have caused this price movement.
Analysis: The move appears most consistent with a broader pullback in semiconductor equities and risk appetite rather than a single UMC-specific negative announcement. This could be because investors are taking profits after a strong run in chip names, with macro-driv
2026-06-16
thequantuminsider.com
2026-06-16
The Quantum Insider
PRESS RELEASE — SEEQC, Inc. (“SEEQC” or the “Company”), a developer and manufacturer of scalable, energy efficient digital chips for quantum computing systems, today announced its participation in a four-year Microelectronics Commons Northeast Regional Defense Technology Hub (NORDTECH) program.
As one of eight U.S. Microelectronics Commons hubs, NORDTECH collaborates with regional partners across