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This study investigates the relationship between effective Rabi frequency and the formation of harmonic frequency combs (HFCs) in ultrafast semiconductor lasers. Using Effective Semiconductor Maxwell-Bloch Equations (ESMBEs), the authors model a unidirectional ring quantum cascade laser (QCL) and de

semiconductor laser Rabi frequency optical frequency comb quantum cascade laser photonics optical communication microwave generation spectroscopy

Keysight and WIN Semiconductors Collaborate to Cut Design Risk for High Frequency RF Components - EEJournal

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www.eejournal.com 2026-07-01

Keysight Technologies and WIN Semiconductors have collaborated to introduce a new GaN MMIC design workflow aimed at reducing design risks for high-frequency RF components. This integrated workflow combines on-chip multi-domain simulation, 3D layout verification, and off-chip MMIC evaluation board de

RF Components GaN MMIC Design Risk Reduction 5G Base Stations Satellite Communications Defense Radar EDA Tools Chip Design

GlobalFoundries Qualifies SLATE Advanced Packaging Technology On 9SW Platform For Next-Generation Radio Frequency Applications - marketscreener.com

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www.marketscreener.com 2026-06-24

GlobalFoundries has successfully validated its SLATE advanced packaging technology on the 9SW platform, marking a significant advancement for next-generation RF applications. This validation demonstrates GlobalFoundries' technical capabilities in advanced packaging and strengthens its competitive po

GlobalFoundries SLATE packaging technology 9SW platform RF applications Advanced packaging Semiconductor manufacturing Chip packaging RF chips

GlobalFoundries qualifies SLATE™ advanced packaging technology on 9SW platform for next-generation radio frequency applications - The Manila Times

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www.manilatimes.net 2026-06-23

GlobalFoundries has announced that its SLATE™ wafer-to-wafer bonding technology is now production-ready on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) platform, enabling compact and high-performance front-end modules (FEMs) for next-generation 5G devices. Manufactured at i

RF Front-End Modules 3D Integration Advanced Packaging 5G Communication RF-SOI Platform Semiconductor Manufacturing FEM Design Wafer-to-Wafer Bonding

advanced packaging technology on 9SW platform for next-generation radio frequency applications - GlobalFoundries

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gf.com 2026-06-23

GlobalFoundries announces advanced packaging technology adoption on its 9SW platform for next-generation radio frequency applications, marking a significant advancement in semiconductor manufacturing. The 9SW platform's integration of advanced packaging techniques enables substantial performance and

Advanced Packaging RF Technology Semiconductor Manufacturing GlobalFoundries 9SW Platform Radio Frequency Applications Chip Packaging Semiconductor Industry

Kyungpook National University Professor Daehyun Kim’s Team Achieves World’s First 700 GHz Frequency Breakthrough in Gallium Nitride Electronic Devices - 아시아경제

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www.asiae.co.kr 2026-06-23

Researchers led by Professor Daehyun Kim from Kyungpook National University have achieved a world-first breakthrough in gallium nitride (GaN) high electron mobility transistor (HEMT) technology, reaching a maximum oscillation frequency (fmax) of 742 GHz—exceeding the 700 GHz threshold for the first

Gallium Nitride High-frequency Devices RF Semiconductor HEMT Semiconductor Materials Electronic Engineering Research Achievement VLSI Symposium

Frequency Triplers Market Growth Forecast to 2035: UV Laser Demand and Semiconductor Lithography Drive Expansion - News and Statistics - IndexBox

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www.indexbox.io 2026-06-14

According to IndexBox market analysis report, the frequency tripler market is projected to achieve significant growth by 2035, primarily driven by surging demand for UV lasers and advances in semiconductor lithography technology. Frequency multipliers, as critical components in laser systems, can tr

Frequency Tripler Semiconductor Manufacturing UV Laser Photolithography Market Forecast Technology Development Supply Chain Semiconductor Equipment

TDK launches new DC-link film capacitors for high-frequency SiC power converters - Charged EVs

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news.google.com 2026-06-04

Dual rare-earth modification and interface engineering in SiC based heterostructures for multi-frequency electromagnetic wave absorption - EurekAlert!

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www.eurekalert.org 2026-05-28

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