Semiconductor News & Analysis Feed
37 articles
2026-06-18
semiengineering.com
2026-06-18
Semiconductor Engineering
2026-06-18
www.indexbox.io
2026-06-18
IndexBox
2026-06-18
digitimes.com
2026-06-18
Samsung Electronics has demonstrated a 3D stacked transistor structure with a 42-nanometer gate pitch, a research milestone that extends vertical integration, long used in memory chips, into logic semiconductors.
2026-06-18
digitimes.com
2026-06-18
Imec and Sony Semiconductor Solutions Corporation (Sony) have jointly presented a new integration method for connecting the front and back sides of semiconductor wafers, a step the two organizations say could support future 3D chip-stacking designs for logic and memory devices.
2026-06-16
digitimes.com
2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-12
digitimes.com
2026-06-12
Taiwan's semiconductor and electronics supply-chain companies continued to post generally firm sales in May, according to monthly revenue data and company disclosures, with the strongest accumulated growth concentrated in AI-linked logic, testing, substrate, and copper-clad laminate suppliers.
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-10
eetimes.com
2026-06-10
Efinix’ exchangeable logic-and-routing technology aims to cut power and die area while enabling memory integration and greater flexibility for AI edge designs.
2026-06-09
digitimes.com
2026-06-09
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
2026-06-04
iconnect007.com
2026-06-04
I-Connect007
Global Electronics Association Commends the European Commission for Strengthening Technological Sovereignty by Proposing the Chips Act 2.0
June 4, 2026 | Global Electronics Association
Estimated reading time: 2 minutes
The Global Electronics Association applauds the European Commission on releasing the Chips Act 2.0 as a critical part of the Technological Sovereignty Package. This proposal marks
2026-06-03
finance.yahoo.com
2026-06-03
Yahoo Finance
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2026-06-03
www.ad-hoc-news.de
2026-06-03
AD HOC NEWS
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2026-05-29
www.devdiscourse.com
2026-05-29
Devdiscourse
Huawei's LogicFolding Revolution: Breaking Through Chip Design Barriers
Huawei's innovative chip design principle, focusing on signal speed rather than shrinking semiconductors, introduces a new path for China amidst U.S. sanctions. Their approach, known as the Tau Scaling Law, seeks to enhance chip efficiency via tightly connected structures, although its true impact remains debated within the in
2026-05-29
digitimes.com
2026-05-29
Nvidia CEO Jensen Huang gave a media interview after the "trillion-dollar dinner" in Taipei, Taiwan, on May 28, commenting on topics including competition in the artificial intelligence (AI) industry, cloud service providers (CSP) developing in-house application-specific integrated circuits (ASIC), Huawei's technological progress, Taiwan's role as a center of the AI revolution, and energy demand.
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
tomshardware.com
2026-05-28
Luke James
The announcement came two days after Huawei presented LogicFolding and its accompanying Tau Scaling Law at ISCAS 2026.