Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced

This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling.

Multi-die assemblies are facing full system-level challenges, but engineering teams nee...

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate the development of multi-die systems, smoothing paths to high-volume manufacturing and benefiting designers across AI, high-performance computing, automotive, and telecommunications markets worldwide—as well as techn

Multi-die assemblies greatly increase the number of things that can go wrong, and the d...

ASIC design shifts to modular, multi-die systems to beat AI-driven complexity.