Semiconductor News & Analysis Feed
19 articles
2026-08-27
www.bisinfotech.com
2026-08-27
2026-08-25
news.google.com
2026-08-25
2026-08-25
www.newelectronics.co.uk
2026-08-25
2026-08-25
news.google.com
2026-08-25
2026-08-24
semiengineering.com
2026-08-24
2026-08-19
www.streetinsider.com
2026-08-19
2026-08-19
www.voiceofalexandria.com
2026-08-19
2026-08-19
www.bdtonline.com
2026-08-19
2026-08-19
www.enidnews.com
2026-08-19
2026-08-19
news.google.com
2026-08-19
2026-07-27
news.google.com
2026-07-27
2026-07-07
semiengineering.com
2026-07-07
As semiconductor technology advances toward more advanced nodes, testing challenges for multi-chip systems (MCS) are becoming increasingly complex. In mission-critical applications such as data centers and automotive electronics, chip reliability during operation is paramount. Traditional manufactur
2026-07-01
www.indexbox.io
2026-07-01
This article examines the increasingly critical on-chip observability technologies in modern chip design, particularly in the context of artificial intelligence and multi-die system architectures. As chip complexity continues to rise, traditional testing and debugging methods can no longer meet mode
2026-06-09
www.trendforce.com
2026-06-09
Amid rising demand for AI chips and a growing trend toward supply chain diversification, Intel's foundry business is gaining momentum. According to reports from Reuters and The Bull.com citing The Information, Google has reportedly placed orders for over 3 million TPUs with Intel through 2028, follo
2026-05-29
news.synopsys.com
2026-05-29
At the 2026 Samsung Advanced Foundry Ecosystem (SAFE) Forum, Synopsys announced a new collaboration with Samsung Electronics focused on advancing power and performance for AI and multi-die designs on advanced process nodes. The initiative includes a portfolio of AI-powered, production-ready EDA tool
2026-05-29
www.datacenterdynamics.com
2026-05-29
Synopsys and Samsung Foundry have extended their partnership to enhance Synopsys’ portfolio of AI-powered EDA tools, certified interface IP, and silicon test capabilities, aimed at accelerating the time-to-market for AI and multi-die chip designs. Announced during the Samsung Advanced Foundry Ecosys
2026-05-29
sg.finance.yahoo.com
2026-05-29
2026-05-29
www.morningstar.com
2026-05-29
At the 2026 Samsung Advanced Foundry Ecosystem (SAFE) Forum, Synopsys announced significant advancements in collaboration with Samsung Foundry, focusing on enhancing power, performance, and area (PPA) for AI and multi-die designs on the latest process nodes. The partnership emphasizes AI-powered dig
2026-05-21
eetimes.com
2026-05-21
As chiplet technology transitions from concept to practical deployment, the semiconductor industry is increasingly focused on scaling these architectures in production systems. In the AI era, chiplet-based designs are emerging as a key enabler for high-performance computing, yet they face significan