SemiPulse | AI-Powered Semiconductor Supply Chain Intelligence & Market Signals

ELAN Microelectrics's 3Q26 PC momentum stalls on shortages, inventory overhang

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digitimes.com 2026-10-12

Cirrus Logic Acquires INVENTVM Semiconductor To Expand Mixed-Signal Power And Audio Capabilities - Pulse 2.0

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pulse2.com 2026-10-07

Goldman Sachs DRAM Sentiment Indicator: Price expectations for conventional memory and HBM have been reset and are beginning to recover - 富途牛牛

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news.futunn.com 2026-10-01

Goldman Sachs' latest DRAM Sentiment Indicator signals a pivotal inflection point in the memory chip market. The report indicates that price expectations for both conventional DRAM and High Bandwidth Memory (HBM) have undergone a significant reset—shedding the speculative premiums that characterized

DRAM HBM Memory Chips Price Expectations Goldman Sachs Semiconductor Storage Market Sentiment

Micron (NASDAQ:MU) Delivers Strong Q3 Numbers But Inventory Levels Increase - finance.yahoo.com

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finance.yahoo.com 2026-10-01

Nuvacore reveals unconventional Core First CPU IP design strategy

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tomshardware.com 2026-09-30

Nuvacore's "Core First" strategy represents a fundamental philosophical shift in how high-performance CPU IP is developed. By decoupling microarchitecture design from ISA commitment, the company is attempting to solve a long-standing tension in processor engineering: the ISA dictates front-end behav

CPU Design ISA Microarchitecture AI Infrastructure Data Center Semiconductor IP Processor Core Performance Optimization

Samsung Executive: HBM to Consume Nearly 30% of Global DRAM Capacity Next Year, Accelerating Squeeze on Conventional Memory Supply - finance.biggo.com

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finance.biggo.com 2026-09-30

Samsung: HBM to account for nearly 30% of DRAM production capacity next year, potentially tightening supply of conventional memory - 富途牛牛

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news.futunn.com 2026-09-28

Samsung's decision to allocate nearly 30% of its DRAM production capacity to HBM next year signals a decisive strategic pivot toward AI-driven memory demand. This is not merely a product-mix adjustment but a structural reallocation of wafer resources, given that HBM's TSV stacking and advanced packa

Samsung HBM High Bandwidth Memory DRAM Conventional Memory AI Memory Production Capacity Supply-Demand

TEKEVER raises $580M Series D, DTCP closes €455M defence fund, and the challenge to reinvent chip design - tech.eu

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tech.eu 2026-09-25

SPRIND and NADI launch €40M challenge to reinvent European chip design - Tech.eu

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tech.eu 2026-09-23

Samsung to outsource more conventional memory production, focus on HBM - Communications Today

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www.communicationstoday.co.in 2026-09-16

[News] Samsung Reportedly Shifts Cheonan Capacity to HBM Packaging, Outsource Conventional Memory Modules - TrendForce

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