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NVIDIA52 TSMC28 AMD18 Intel15 SK Hynix11 Microsoft11 Micron Technology10 Samsung10 Micron10 Samsung Electronics9 Meta Platforms8 Applied Materials8 Apple8 Synopsys7 ASML6
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2026-05-20
[News] Intel Says EMIB Customers Back Substrate Prepayments; 4 Taiwan, 2 Japan Suppliers Seek Commitments - TrendForce
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www.trendforce.com 2026-05-20 TrendForce
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2026-05-14
[News] TSMC Sees AI Wafer Demand Rising 11x From 2022–2026, Targets CoWoS With 24 HBM Stacks in 2029 - TrendForce
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www.trendforce.com 2026-05-14 TrendForce
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TSMCAI chipsWafer manufacturingAI compute demandSemiconductor supply chainAdvanced process nodesCoWoS technologyHBM stacking
2026-05-14
[News] China’s Wide Bandgap Chip Players Diverge, as GaN RF Surges; SiC Profitability Under Pressure - TrendForce
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www.trendforce.com 2026-05-14 TrendForce
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Wide BandgapGaN RFSiCPower SemiconductorRF ChipSemiconductor MaterialChip ManufacturingMarket Diversification
2026-05-12
[News] MediaTek Reportedly Adopts Dual Packaging Strategy With Intel EMIB, TSMC CoWoS for AI ASIC Push - TrendForce
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www.trendforce.com 2026-05-12 TrendForce
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MediaTekTSMCIntelAI chipASICPackaging technologyEMIBCoWoS
2026-05-11
[News] SK hynix Reportedly Tests Intel EMIB 2.5D Packaging With HBM Amid TSMC CoWoS Tightness - TrendForce
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www.trendforce.com 2026-05-11 TrendForce
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Semiconductor PackagingEMIB TechnologyHBM MemoryTSMCSK HynixIntel2.5D PackagingChip Manufacturing
2026-05-11
TrendForce Sees Tightening Advanced Packaging and 3nm Capacity as AI Competition Turns Into a Supply Chain Arms Race - EE Times Asia
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news.google.com 2026-05-11 EE Times Asia
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2026-05-04
[News] Intel’s EMIB Reportedly Gains Traction at Google, Meta; Yields Said to Reach ~90% Milestone - TrendForce
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www.trendforce.com 2026-05-04 TrendForce