Semiconductor News & Analysis Feed

541 articles
2026-07-06
news.google.com 2026-07-06 Let's Data Science
2026-07-06
news.futunn.com 2026-07-06 富途牛牛
2026-07-06
news.google.com 2026-07-06 digitimes
2026-07-06
news.google.com 2026-07-06 digitimes
2026-07-06
news.google.com 2026-07-06 Insider Monkey
2026-07-06
digitimes.com 2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com 2026-07-06
Greatek Electronics, a subsidiary of memory packaging and testing provider Powertech Technology (PTI), has approved the acquisition of On Semiconductor SSMP Philippines, a packaging and testing services company under the On Semiconductor (Onsemi) group, using internal funds. The acquisition aims to strengthen the group's overseas operational footprint and improve its global customer service capabi
2026-07-06
digitimes.com 2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com 2026-07-06
LG Chem has begun supplying semiconductor strippers to Amkor Technology, a major US-based packaging and testing provider, in its first commercial move into the market. The deal highlights rising demand for advanced chip-making chemicals as artificial intelligence, high-bandwidth memory, and smaller device designs reshape global semiconductor manufacturing.
2026-07-05
news.google.com 2026-07-05 BusinessToday Malaysia
2026-07-05
news.google.com 2026-07-05 BusinessToday Malaysia
2026-07-05
www.digitimes.com 2026-07-05 digitimes
2026-07-05
digitimes.com 2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-05
news.google.com 2026-07-05 Interesting Engineering
2026-07-04
www.ad-hoc-news.de 2026-07-04 Ad-hoc-news.de
2026-07-04
finance.biggo.com 2026-07-04 finance.biggo.com
2026-07-04
theindependent.sg 2026-07-04 The Independent Singapore News
2026-07-04
digitimes.com 2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-04
www.klsescreener.com 2026-07-04 KLSE Screener
2026-07-04
www.thestar.com.my 2026-07-04 The Star