Semiconductor News & Analysis Feed
541 articles
2026-06-27
www.digitimes.com
2026-06-27
digitimes
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply...
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2026-06-27
news.futunn.com
2026-06-27
富途牛牛
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2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
www.asiae.co.kr
2026-06-27
아시아경제
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2026-06-27
www.msn.com
2026-06-27
MSN
Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.
“In our view, these insights reflect broader tech trends reshaping the entire semi supply chain,” Susquehanna analyst Mehdi Hosseini wrote in a note to clients. “The rising complexity of next-gen DRA
2026-06-26
seekingalpha.com
2026-06-26
Seeking Alpha
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2026-06-26
www.semiconductor-today.com
2026-06-26
Semiconductor Today
The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG henc
2026-06-26
simplywall.st
2026-06-26
simplywall.st
United States/Semiconductors/NasdaqGS:AMAT
Applied Materials (AMAT) Unveils AI Chip Tools For 3D Memory And Packaging
June 26, 2026
Simply Wall St
Reviewed by Bailey Pemberton
Applied Materials (NasdaqGS:AMAT) has introduced a new suite of chipmaking systems focused on advanced 3D chip architectures for AI.
The platforms target high bandwidth memory, 3D DRAM structures, advanced packaging, and pro
2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
uk.finance.yahoo.com
2026-06-26
Yahoo Finance UK
Is Applied Materials (AMAT) Quietly Rewiring Its AI Moat With New DRAM And Packaging Tools?
Sasha Jovanovic
Thu, 25 June 2026 at 8:19 pm GMT-7 3 min read
AMAT
+13.42%
In recent days, Applied Materials introduced a new epitaxy system for DRAM, plus CMP, deposition and eBeam tools aimed at advanced 3D packaging and high-bandwidth memory to support next-generation AI chips.
This push ties front-end
2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 10:39
Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor##
HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th
2026-06-26
digitimes.com
2026-06-26
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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2026-06-25
finance.yahoo.com
2026-06-25
Yahoo Finance
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Applied Materials Introduces New Systems to Accelerate DRAM and Advanced Packaging for AI Chips
Applied Materials, Inc.
Thu, June 25, 2026 at 6:00 AM PDT 6 min read
AMAT
-3.33%
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Applied Materials, Inc.
Innovations spanning DRAM and advanced packaging enable the
2026-06-25
www.globenewswire.com
2026-06-25
GlobeNewswire
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step—boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.igorslab.de
2026-06-25
igor´sLAB
LATEST NEWS
ASE is building 15 new sites: Advanced Packaging is becoming the next major AI bottleneck
25. June 2026 06:00Samir Bashir
📖 Reading time: approx. 9 minutes · 1,647 words · 10,736 characters
In the case of AI chips, people like to talk about transistors, HBM bandwidth, and compute performance. Eventually, however, the GPU, memory, chiplets, and power supply must actually be assembled i