Semiconductor News & Analysis Feed
668 articles
2026-06-12
www.eenewseurope.com
2026-06-12
eeNews Europe
NVIDIA says its GPUs with Confidential Computing are now being used for confidential inference in Apple’s Private Cloud Compute, as Apple extends the system beyond its own data centres to Google Cloud. The move brings NVIDIA Blackwell GPUs into the hardware security architecture that supports some server-side Apple Intelligence workloads.
2026-06-12
finance.yahoo.com
2026-06-12
Yahoo Finance
Does onsemi's New GaNEXUS Toolkit Subtly Reframe Its Long-Term Power Leadership Story (ON)?
Simply Wall St
Fri, June 12, 2026 at 12:12 AM PDT 3 min read
ON
+5.26%
Trade ON on Coinbase
Trading disclosure
Earlier in June 2026, onsemi launched its GaNEXUS gallium nitride power portfolio and unveiled the cloud-based Elite Pairing Studio to simplify SiC MOSFET–gate driver selection for demanding appli
2026-06-12
startupfortune.com
2026-06-12
Startup Fortune
Infineon Technologies will open its Smart Power Fab in Dresden on July 2, putting a €5 billion European chip bet behind the power semiconductors AI data centers now need in volume.
The date matters because this is not another distant semiconductor promise. Infineon is bringing its Dresden Smart Power Fab forward from an autumn opening to July 2, 2026, after three years of construction and a deman
2026-06-12
www.moomoo.com
2026-06-12
Moomoo
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2026-06-12
www.digitimes.com
2026-06-12
digitimes
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these...
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2026-06-12
digitimes.com
2026-06-12
Taiwanese power management IC supplier Global Mixed-mode Technology (GMT) will follow peers in seeking price increases from customers as tight chip supply continues to reshape capacity allocation across the industry.
2026-06-12
digitimes.com
2026-06-12
In power electronics engineering, Silicon Carbide (SiC) companies are competing to achieve the absolute lowest thermal resistance (Rth), with the mindset that lower heat signature equates a superior system. However, at PCIM Europe 2026, a collaborative project between Rohm Semiconductor, Schweizer Electronic, and eMoveUs GmbH exposed a revolutionary counter-intuitive shift in design philosophy: wi
2026-06-12
digitimes.com
2026-06-12
Powerlogic reported that a surge in demand for AI servers, a reallocation of supply-chain resources, higher memory prices, and delayed consumer upgrade cycles reduced short-term sales, pressuring its May results and revenues for the first five months of the year. The company disclosed May revenue of NT$63.87 million (US$2 million), down 29.37% month-over-month, and cumulative revenue for the first
2026-06-12
digitimes.com
2026-06-12
Cadence and Intel Foundry are expanding their collaboration on advanced chip design, a move that could affect future semiconductors used in devices and data centers worldwide. The agreement aims to improve performance, power efficiency, and design readiness as chipmakers race to bring next-generation technologies to market.
2026-06-12
digitimes.com
2026-06-12
The artificial intelligence (AI) industry is expanding at a pace that the physical world cannot match, and the gap between digital demand and real-world supply is widening across every layer of the infrastructure stack, from power generation to chip manufacturing to data center construction. That was the assessment of Sachin Hindupur, global strategy and operations leader at AMD, in a presentation
2026-06-12
digitimes.com
2026-06-12
As wide-bandgap (WBG) semiconductors like silicon carbide (SiC) and gallium nitride (GaN) take the lead in electric vehicle (EV) powertrains, electronics packaging engineers are facing a thermodynamic reckoning. To extract maximum performance from these high-frequency, high-efficiency chips, the industry is driving an architectural shift: shrinking inverter volumes, eliminating heavy copper basepl
2026-06-12
digitimes.com
2026-06-12
United Nova Technology (UNT) is expanding from automotive and industrial chips into AI server power management and optical interconnects through a CNY20 billion (US$3 billion) 12-inch mixed-signal fab project.
2026-06-12
digitimes.com
2026-06-12
Power semiconductors are taking on a central role as AI data centers move from 800V high-voltage input down through multiple power-conversion stages to the ultra-low voltages used by chips. After the post-pandemic inventory correction, industry players say power semiconductors have shifted "from a supporting role to the lead" under the new AI high-voltage direct current (HVDC) power architecture.
2026-06-12
stockstotrade.com
2026-06-12
StocksToTrade
Entegris Inc. stocks have been trading up by 11.38 percent on optimism surrounding strengthened semiconductor supply-chain demand.
Key Takeaways For ENTG Traders
Mizuho lifted its Entegris (ENTG) price target to $180 from $175 and kept an Outperform rating, pointing to strength in wafer fab equipment and Entegris’ leverage to the WFE upcycle.
A new cross-licensing pact with JSR and Inpria ends a
2026-06-12
kotaku.com
2026-06-12
Kotaku
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2026-06-11
www.techinsights.com
2026-06-11
TechInsights
EUV Lithography: A Power-Hungry Path to Innovation
Discover the energy-intensive realities of EUV lithography and its impact on semiconductor innovation—read how industry leaders are addressing sustainability challenges in our full report.
The Energy Cost of Technological Advancement
Extreme ultraviolet (EUV) lithography has revolutionized semiconductor manufacturing, enabling the production of
2026-06-11
www.techpowerup.com
2026-06-11
TechPowerUp
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2026-06-11
www.automotivepowertraintechnologyinternational.com
2026-06-11
Automotive Powertrain Technology International
ROHM has unveiled the TSC3PAK (14.00 x 18.58 x 3.50mm) cooling package for SiC MOSFETs, which adopts a top-side heat dissipation structure that places the heat dissipation surface on the top of the package, enabling automated mounting while achieving heat dissipation performance comparable to that of conventional through-hole packages (TO-247-4L). This contributes to greater efficiency and reliabi
2026-06-11
www.roboticstomorrow.com
2026-06-11
Robotics Tomorrow
As a leading supplier of NVIDIA RTX PRO™ 6000 Blackwell Series, PNY empowers organizations to meet the demands of modern AI workflows, from rapid prototyping to scalable deployment.
Unleash AI Innovation: The Power of NVIDIA RTX PRO 6000 Blackwell Workstation Edition Fueled by PNY-Supplied GPUs
Article from | PNY
06/11/26, 05:54 AM | Industrial Robotics, Factory Automation | PNY | Agentic AI, a
2026-06-11
www.roboticstomorrow.com
2026-06-11
Robotics Tomorrow
As a leading supplier of NVIDIA RTX PRO™ 6000 Blackwell Series, PNY empowers organizations to meet the demands of modern AI workflows, from rapid prototyping to scalable deployment.
Unleash AI Innovation: The Power of NVIDIA RTX PRO 6000 Blackwell Workstation Edition Fueled by PNY-Supplied GPUs
Article from | PNY
06/11/26, 05:54 AM | Industrial Robotics, Factory Automation | PNY | Agentic AI, a