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Solder balls used in semiconductor packaging. (Photo: THE ELEC) South Korean prosecutors have launched a forced investigation after uncovering allegations that semiconductor packaging material suppliers colluded on pricing and supply volumes. The Criminal Proceeds Recovery Division of the Seoul Central District Prosecutors' Office, headed by Chief Prosecutor So Jung-soo, began search and seizure

Innolux plans to accelerate its transformation in 2026, with chairman and CEO Jim Hung pointing to three priorities: advanced semiconductor packaging, smart cockpits, and higher-margin panel applications.

Intel is reportedly making a major push into advanced semiconductor packaging as it seeks to strengthen its foundry business and expand capacity for its Embedded Multi-die Interconnect Bridge (EMIB) technology, according to ETNews.

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