Semiconductor News & Analysis Feed
312 articles
2026-07-10
www.tomshardware.com
2026-07-10
Tom's Hardware
2026-07-10
tomshardware.com
2026-07-10
Anton Shilov
Japanese chipmaker Rapidus discloses one more aspect of its strategy: to offer lower quotes than TSMC.
2026-07-10
siliconangle.com
2026-07-10
SiliconANGLE
2026-07-10
digitimes.com
2026-07-10
ASML, Imec and TSMC are collaborating in southern Taiwan to develop manufacturing equipment for two-dimensional (2D) semiconductor materials, marking a significant step toward commercializing technologies widely viewed as essential for extending Moore's Law beyond the limits of conventional silicon scaling.
2026-07-09
www.openpr.com
2026-07-09
openPR.com
2026-07-09
www.openpr.com
2026-07-09
openPR.com
2026-07-09
www.businesstimes.com.sg
2026-07-09
The Business Times
2026-07-09
digitimes.com
2026-07-09
China's rumored tentative plan to allow a handful of its largest artificial intelligence (AI) companies to purchase a small number of Nvidia H200 chips has implications that extend well beyond a single procurement decision. The plan is possibly, though not only, for the shifting balance between US export leverage and Beijing's push to reduce its dependence on foreign silicon.
2026-07-09
digitimes.com
2026-07-09
Apple's decision to commit more than US$30 billion to Broadcom over the next several years carries implications that reach well beyond a single procurement contract — potentially reshaping, though not limited to, how the iPhone maker approaches custom-silicon design and how far it is willing to anchor critical chip production inside the US.
2026-07-08
finance.yahoo.com
2026-07-08
Yahoo Finance
2026-07-08
tomshardware.com
2026-07-08
Anton Shilov
SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.
2026-07-08
aws.amazon.com
2026-07-08
Amazon Web Services (AWS)
2026-07-08
www.zacks.com
2026-07-08
Zacks Investment Research
2026-07-08
digitimes.com
2026-07-08
France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges, cooperation is now showing up in steel, silicon, and server racks. Foxconn, SiPearl, and a growing list of AI data center projects are turning bilateral goodwill into industrial output.
2026-07-07
news.google.com
2026-07-07
Business Wire
2026-07-07
www.tomshardware.com
2026-07-07
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck
News
By Etiido Uko
Published 2 days ago
The patent was filed 18 months ago, and there's no further indication of ongoing development
(Image credit: Intel)
Share
2026-07-07
tomshardware.com
2026-07-07
Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
2026-07-07
www.ledinside.com
2026-07-07
LEDinside
The German Federal Ministry of Education and Research (BMBF) has launched a new collaborative initiative to develop microLED microdisplays for AR applications.
The microPRO project, as it is known, includes ALLOS Semiconductors, Fraunhofer IPMS, Jabil Optics, Mimetik, Maintastic, and SUSS MicroTec.
The project aims to utilize Industry 4.0 processes and prove the manufacturability of GaN-on-Silii
2026-07-07
siliconangle.com
2026-07-07
SiliconANGLE
SK hynix Inc., the South Korean firm that rivals Samsung Electronics Co. Ltd. and Micron Technology Inc. as one of the world’s top memory chipmakers, said today it will sell almost 17.8 million shares when it launches its U.S. initial public offering later this week.
The sale is expected to help the company raise around $28 billion in funding, based on its closing share price in Seoul earlier tod
2026-07-07
eetimes.com
2026-07-07
MIPS bets RISC-V and ARC AI will power physical AI in cars and factory robots. Watch the interview and learn more.