Samsung Foundry Showcases Future Production Pipeline at SAFE Forum - thelec.net

At the SAFE Forum 2026 held on July 1 at Samsung Electronics' Seocho campus in Seoul, the company's foundry division unveiled its future production roadmap and progress on several customer projects. S... Read original →

Samsung’s 2nm and 1.4nm roadmap unveiled at SAFE 2026 isn’t just a node race—it’s forcing a systemic redesign across the AI chip stack: HBM, UCIe, and Quilt packaging together are pressuring EDA flows, thermal solutions, and test infrastructure to evolve rapidly. Geopolitically, deepening U.S.-Korea tech alignment raises implicit barriers for non-allied clients, especially those in Taiwan, China and mainland China, inflating their supply chain redundancy costs. TSMC will likely accelerate A16/A14 deployment and expand CoWoS capacity while co-opting Intel to broaden the UCIe coalition against Samsung’s ecosystem push. Over the next 18 months, advanced packaging—not transistor scaling—will become the decisive bottleneck, and Samsung’s mass production of 723mm² LPUs has already cemented a generational lead over tier-2 foundries.