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Sandisk and SK hynix unveil HBF spec — up to 16-Hi NAND stacks, 3 TB/s bandwidth, UCIe - Tom's Hardware

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www.tomshardware.com 2026-08-04

Intel XBM: Patent Describes HBM Alternative with UCIe Connection and Backend DRAM - igor´sLAB

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www.igorslab.de 2026-07-10

Intel has filed a patent for XBM (Cross-Batch Memory), a novel memory architecture designed as an alternative to conventional High Bandwidth Memory (HBM). This technology aims to address current limitations in AI accelerators such as bandwidth, packaging costs, and complexity. Unlike traditional HBM

Intel HBM UCIe Memory Architecture AI Accelerators DRAM Backend Transistors Chip Packaging

Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer — backend-transistor DRAM stack uses UCIe links and built-in repair to ease AI's memory bottleneck - Tom's Hardware

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www.tomshardware.com 2026-07-07

Intel has unveiled a new high-bandwidth memory (HBM) architecture through a patent filed in December 2024, aiming to address the packaging and cost bottlenecks associated with current interposer-based HBM solutions. The proposed Cross-Batch Memory (XBM) architecture shifts DRAM cells from the front-

Semiconductor Memory Technology HBM XBM Architecture UCIe Interface Backend Transistor AI Memory Bottleneck Chip Packaging

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