Semiconductor News & Analysis Feed
66 articles
2026-06-05
evertiq.com
2026-06-05
Evertiq
© Cadence
Business | June 05, 2026
Cadence, Samsung Foundry deepen 2nm and 3D‑IC collaboration
Evertiq
Building on the companies’ 2025 announcement of certified Cadence tools and IP on multiple Samsung Foundry nodes, including second-generation 2nm, this new multi-year agreement further broadens the Cadence portfolio of Memory and Interface IP.
US company Cadence and Samsung Foundry have announce
2026-06-03
news.google.com
2026-06-03
EE Times Asia
2026-06-02
thequantuminsider.com
2026-06-02
The Quantum Insider
PRESS RELEASE — Researchers led by Illinois Grainger Engineering professor Qing Cao have demonstrated a scalable way to directly and sequentially stack high-performance silicon circuits. This advance marks a critical step toward realizing the full potential of three-dimensional chips that could carry computing beyond the limits of traditional scaling.
For more than half a century, the power of co
2026-06-02
eetimes.com
2026-06-02
Kevin Zhang said 3D integration is important, but transistor scaling remains the semiconductor industry's primary driver of performance and energy-efficiency gains.
2026-06-01
finance.yahoo.com
2026-06-01
Yahoo Finance
__fail__
2026-06-01
overclock3d.net
2026-06-01
OC3D
Published: June 1, 2026 | Author: Mark Campbell
Nvidia kickstarts a “new era of PC” with RTX Spark
Nvidia revolutionises Windows on ARM with unified memory, RTX graphics, and strong game support
Ahead of Computex 2026, Nvidia teased “a new era of PC“, and it has arrived with RTX Spark. Nvidia has unveiled its RTX Spark Superchip, boasting a 20-core Grace CPU, strong Blackwell RTX graphics, and u
2026-06-01
tomshardware.com
2026-06-01
Jake Roach
AMD is rereleasing the Ryzen 7 5800X3D and introducing the Ryzen 7 7700X3D, both eight-core chips with 3DV-Cache targeting midrange gamers who’ve been under the thumb of rising component prices.
2026-05-31
www.thelec.net
2026-05-31
thelec.net
SemiFive sets up a booth at SAFE Forum 2026 held at Samsung Electronics' US office on May 28. (Photo: SemiFive)
Brandon Cho, chief executive officer of SemiFive, presented the company's "Advanced 3D-IC and Big Die Solutions for AI Innovation" at Samsung Electronics' SAFE Forum 2026 held on May 28 in the US.
Application-specific integrated circuit (ASIC) design based on 3D-IC technology verticall
2026-05-31
overclock3d.net
2026-05-31
OC3D
Published: May 31, 2026 | Source: Videocardz | Author: Mark Campbell
Nvidia N1 and N1x Laptop chip Specifications Leak
Specifications leak for Nvidia’s upcoming laptop chips
Specifications for Nvidia’s upcoming Nvidia N1 and Nvidia N1x chips have leaked, new laptop processors that bring together ARM CPU cores and Nvidia Blackwell graphics. Nvidia has been teasing “A new era of PC“, and this seem
2026-05-31
techxplore.com
2026-05-31
Tech Xplore
__fail__
2026-05-30
tomshardware.com
2026-05-30
Jowi Morales
These inflatable boats use basalt fiber to reduce radar returns and RF interference.
2026-05-30
digitimes.com
2026-05-30
India has signed a memorandum of understanding (MoU) with Intel and US-based 3DGS to establish an advanced packaging glass-core substrate manufacturing facility in the eastern state of Odisha, marking Intel's first significant participation in India's semiconductor manufacturing ecosystem beyond its existing design and technology operations.
2026-05-30
www.hpcwire.com
2026-05-30
HPCwire
www.hpcwire.com
Performing security verification
This website uses a security service to protect against malicious bots. This page is displayed while the website verifies you are not a bot.
Ray ID: a037a9e1cff08b8b
Performance and Security by Cloudflare
Privacy
2026-05-30
overclock3d.net
2026-05-30
OC3D
Published: May 29, 2026 | Source: Nvidia | Author: Mark Campbell
Nvidia teases “a new era of PC” ahead of Computex
Nvidia GeForce promises “A New Era of PC”
Nvidia GeForce has posted a cryptic message on Twitter/X, promising “A new era of PC” and a strange set of numbers (25.0528, 121.5990). I know what you are all thinking: “The number Mason, what do they mean?” (Old reference…) We have the ans
2026-05-29
tomshardware.com
2026-05-29
Jake Roach
Acer has two new gaming laptops for Computex, including its first laptop with the Ryzen 9 9955HX3D CPU, and a device that sports triple PCIe 5.0 storage.
2026-05-29
www.prnewswire.com
2026-05-29
PR Newswire
SEMIFIVE Showcases Advanced 3D-IC and Big Die Solutions for AI Semiconductor Innovation at SAFE™ Forum 2026
NEWS PROVIDED BY
SEMIFIVE
May 28, 2026, 18:03 ET
SHARE THIS ARTICLE
SAN JOSE, Calif., May 28, 2026 /PRNewswire/ -- SEMIFIVE, a leading global provider of custom AI semiconductor (ASIC) solutions, today announced its participation in the Samsung Advanced Foundry Ecosystem (SAFE™) Fo
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/cadence-and-samsung-foundry-deepen-2nm-and-3d-ic-collaboration-ce7f5ddade8af222" on this server.
Reference #18.8c813217.1779997989.9e64c495
https://errors.edgesuite.net/18.8c813217.1779997989.9e64c495
2026-05-29
www.tradingview.com
2026-05-29
TradingView
__fail__
2026-05-29
www.marketscreener.com
2026-05-29
marketscreener.com
Access Denied
You don't have permission to access "http://www.marketscreener.com/news/cadence-and-samsung-foundry-deepen-2nm-and-3da-ic-collaboration-to-meet-surging-ai-infrastructure-a-ce7f5ddadf8dfe21" on this server.
Reference #18.85813217.1779989089.4a6df450
https://errors.edgesuite.net/18.85813217.1779989089.4a6df450
2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
News
By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
Share this article
0
Join the conversatio