Feed Deep Dive Matrix Subscribe About

Semiconductor News & Analysis Feed

613 articles
Trending Companies
NVIDIA100 TSMC43 SK Hynix29 Samsung Electronics28 Samsung28 Micron24 Micron Technology24 SK hynix22 Intel22 Infineon20 Microsoft18 AMD17 Apple14 Google13 SanDisk12
Trending Technologies
EUV113 3nm93 AI36 HBM34 DRAM24 AI chips23 GPU22 NAND flash17 memory chips16 advanced packaging14 AI infrastructure9 semiconductor9 AI data center8 HBM47 IoT6
2026-07-08
Can AMAT's Advanced Packaging Drive Its Next Growth Phase? - Yahoo Finance
0.92
finance.yahoo.com 2026-07-08 Yahoo Finance
2026-07-08
JEDEC releases new SPHBM4 standard to slash AI memory costs
0.85
tomshardware.com 2026-07-08 Anton Shilov
SPHBM4 promises HBM4-class bandwidth without usage of silicon interposer and CoWoS-like packaging.
JEDEC standardHigh Bandwidth MemoryAI processorsHBM4SPHBM4Memory technologySemiconductor industryChip design
2026-07-08
Semiconductor Mold Rubber Cleaning Sheet Market Growth Driven by Advanced Packaging Demand Through 2035 - News and Statistics - IndexBox
0.75
www.indexbox.io 2026-07-08 IndexBox
2026-07-08
TSMC CoWoS packaging service - capacity push for demanding AI chips - AD HOC NEWS
0.95
www.ad-hoc-news.de 2026-07-08 AD HOC NEWS
2026-07-08
Advanced packaging is poised for a pivotal shift: Goldman Sachs is bullish on the leading glass substrate player, while Ming-Chi Kuo strongly backs Taiwan Semiconductor (TSM.US). - Moomoo
0.95
www.moomoo.com 2026-07-08 Moomoo
2026-07-08
The Latest News In IC Packaging & Test - Semiecosystem
0.88
marklapedus.substack.com 2026-07-08 Semiecosystem
2026-07-08
Nexperia’s 1200 V SiC MOSFETs in QDPAK packaging - Electronics Weekly
0.9
www.electronicsweekly.com 2026-07-08 Electronics Weekly
2026-07-07
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging - Business Wire
0.95
news.google.com 2026-07-07 Business Wire
2026-07-07
Intel patent reveals new XBM memory architecture that ditches HBM's costly silicon interposer
0.92
tomshardware.com 2026-07-07 Etiido Uko
Intel’s XBM patent proposes an HBM alternative that uses backend-transistor DRAM, UCIe chiplet links, and repair logic to reduce packaging costs and complexity.
Semiconductor MemoryHigh-Bandwidth MemoryHBMSilicon InterposerMemory ArchitectureIntel PatentUCIe InterfaceBEOL Technology
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 - GlobeNewswire
0.95
www.globenewswire.com 2026-07-07 GlobeNewswire
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance UK
0.9
uk.finance.yahoo.com 2026-07-07 Yahoo Finance UK
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance
0.95
finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
Huawei's Mate 90 to debut Kirin 2026 processor built on Tau Law
0.95
digitimes.com 2026-07-07
Huawei's next-generation flagship Mate 90 smartphone series has reportedly entered the chip packaging and testing stage, according to sources within China's supply chain. The lineup is expected to launch in September 2026 and will be the first to feature Huawei's new Kirin 2026 flagship processor, which is based on the company's Tau Scaling (τ) concept. The device is expected to be one of Huawei's
2026-07-07
6G base stations to become AI computing nodes, boosting advanced packaging demand
0.92
digitimes.com 2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
AI server demand tightens power device supply as lead times stretch to 270 days
0.92
digitimes.com 2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-07
TSMC's AI bottleneck spills demand across the semiconductor supply chain
0.95
digitimes.com 2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac
2026-07-07
Inspection And Metrology Catching Up For High-Density Fan-Out Panel Packaging
0.92
semiengineering.com 2026-07-07 Anne Meixner
Optical methods need to comply with increasing warpage, finer RDL pitch, and trace size.
Semiconductor PackagingPanel-Level PackagingHigh-Density Fan-OutInspection TechnologyMetrology EquipmentAI ChipsHPC DevicesRDL Layers
2026-07-07
6G base stations to become AI computing nodes, boosting advanced packaging demand - digitimes
0.95
www.digitimes.com 2026-07-07 digitimes
2026-07-07
Vadzo Imaging Introduces Falcon-544MRH: 5MP Monochrome Autofocus USB Camera Based on Onsemi HyperLux LP AR0544 - Newswire.com
0.95
www.newswire.com 2026-07-07 Newswire.com
2026-07-06
Nvidia and Intel Highlight U.S. Chip Supply Gains, Packaging Gaps Persist - Let's Data Science
0.85
news.google.com 2026-07-06 Let's Data Science