Semiconductor News & Analysis Feed
608 articles
2026-06-28
finance.yahoo.com
2026-06-28
Yahoo Finance
Taiwan Semiconductor (TSM), Amkor (AMKR) Form 10-Year Partnership for Advanced Semiconductor Packaging in Arizona
Maham Fatima
June 27, 2026 2 min read
2330.TW
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Taiwan Semiconductor Manufacturing Company Limited (NYSE:TSM) is one of the best future stocks to buy and hold for 10 years. On June 16, TSMC and Amkor Technology
2026-06-27
simplywall.st
2026-06-27
simplywall.st
United States/Semiconductors/NasdaqGS:KLIC
Kulicke And Soffa Industries (KLIC) Following Advanced Packaging Demand Is The Rally Already Priced In
June 27, 2026
Simply Wall St
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Advanced packaging demand puts Kulicke and Soffa Industries (KLIC) in focus
Kulicke and Soffa Industries (KLIC) is drawing fresh investor attention as strong demand for its Thermo Compression Bo
2026-06-27
www.digitimes.com
2026-06-27
digitimes
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply...
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2026-06-27
news.futunn.com
2026-06-27
富途牛牛
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2026-06-27
digitimes.com
2026-06-27
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging, testing, and optoelectronic integration capabilities under Foxconn's "3+3+3" strategy to seize advanced packaging opportunities in AI optical communications.
2026-06-27
digitimes.com
2026-06-27
China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic substitution are driving a new capacity cycle.
2026-06-27
digitimes.com
2026-06-27
Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply global foundry and OSAT customers, ETNewsand Yonhapreported.
2026-06-27
www.asiae.co.kr
2026-06-27
아시아경제
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2026-06-27
www.msn.com
2026-06-27
MSN
Applied Materials (AMAT) held a master class event this week, and much of the focus was on the company's positioning in dynamic random access memory and advanced packaging, Wall Street analysts said.
“In our view, these insights reflect broader tech trends reshaping the entire semi supply chain,” Susquehanna analyst Mehdi Hosseini wrote in a note to clients. “The rising complexity of next-gen DRA
2026-06-26
seekingalpha.com
2026-06-26
Seeking Alpha
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2026-06-26
www.semiconductor-today.com
2026-06-26
Semiconductor Today
The demand for higher power densities in increasingly space-constrained environments continues to grow, whether in on-board chargers for electric vehicles or power supplies for AI data centers. At the recent PCIM Europe 2026 (Power Electronics, Intelligent Motion, Renewable Energy and Energy Management) Expo & Conference in Nuremberg, Germany (9–11 June), Munich-based Infineon Technologies AG henc
2026-06-26
simplywall.st
2026-06-26
simplywall.st
United States/Semiconductors/NasdaqGS:AMAT
Applied Materials (AMAT) Unveils AI Chip Tools For 3D Memory And Packaging
June 26, 2026
Simply Wall St
Reviewed by Bailey Pemberton
Applied Materials (NasdaqGS:AMAT) has introduced a new suite of chipmaking systems focused on advanced 3D chip architectures for AI.
The platforms target high bandwidth memory, 3D DRAM structures, advanced packaging, and pro
2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
en.sedaily.com
2026-06-26
Seoul Economic Daily
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2026-06-26
uk.finance.yahoo.com
2026-06-26
Yahoo Finance UK
Is Applied Materials (AMAT) Quietly Rewiring Its AI Moat With New DRAM And Packaging Tools?
Sasha Jovanovic
Thu, 25 June 2026 at 8:19 pm GMT-7 3 min read
AMAT
+13.42%
In recent days, Applied Materials introduced a new epitaxy system for DRAM, plus CMP, deposition and eBeam tools aimed at advanced 3D packaging and high-bandwidth memory to support next-generation AI chips.
This push ties front-end
2026-06-26
biz.chosun.com
2026-06-26
Chosunbiz
By
Jeong Du-yong
Published 2026.06.26. 10:39
Product image of the new FC Bonder 3.5 for artificial intelligence (AI) system semiconductors from ##HANMI Semiconductor##./Courtesy of ##HANMI Semiconductor##
HANMI Semiconductor said on the 26th it launched new equipment for artificial intelligence (AI) system semiconductors, the "FC Bonder 3.5" (Flip Chip Bonder 3.5). The company plans to supply th
2026-06-26
digitimes.com
2026-06-26
Corning is studying South Korea as a possible manufacturing base for semiconductor glass substrates, a sign that the US specialty glass and optical materials maker is looking to extend its AI exposure beyond data-center connectivity into advanced chip packaging.
2026-06-26
www.newswire.com
2026-06-26
Newswire.com
Vadzo Imaging Explains AR0234 vs AR0235: How to Choose the Right 2MP Global Shutter USB Camera for Speed-Critical Applications
PRESS RELEASE • JUN 25, 2026 18:00 UTC
2MP global shutter imaging at up to 120fps forms the common baseline for both the Onsemi AR0234 and the Onsemi AR0235 HyperLux SG, with the AR0234 delivering a 1/2.6-inch optical format at 3.0 µm pixel pitch and the AR0235 delivering
2026-06-25
www.manilatimes.net
2026-06-25
The Manila Times
Innovations spanning DRAM and advanced packaging enable the 3D architectures behind cutting-edge AI chips
A new epitaxy system optimized for DRAM fabs adds a critical logic-class step-boosting memory speed and efficiency while maximizing output within tight fab footprint and supply constraints
New CMP and deposition systems target the most critical advanced packaging steps, delivering higher-yield
2026-06-25
www.marketscreener.com
2026-06-25
marketscreener.com
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