Semiconductor News & Analysis Feed

10757 articles
2026-06-18
smallcaps.com.au 2026-06-18 smallcaps.com.au
dorsaVi (ASX: DVL) has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip. The company has developed the chip with NTU Singapore and ITRI Taiwan, and is now ready to move into tape-out and staged silicon implementation. The design incorporates self-checking write-and-verify circuitry, compute-in
2026-06-18
www.tradingview.com 2026-06-18 TradingView
News / Small Caps / dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI dorsaVi Finalises RRAM-CMOS Validation Chip Design for Ultra-Edge AI 2 min read DVL 0 dorsaVi DVL has finalised the design package for its first integrated resistive random access memory-complementary metal-oxide semiconductor (RRAM-CMOS) validation chip. The company has developed the chip with NTU Singapo
2026-06-18
www.igorslab.de 2026-06-18 igor´sLAB
LATEST NEWS Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus 18. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,294 words · 8,532 characters An acquisition worth up to ten billion US dollars is not an impulsive purchase between two board meetings, even in the semiconductor industry. Qualcomm i
2026-06-18
www.igorslab.de 2026-06-18 igor´sLAB
LATEST NEWS Qualcomm is reportedly considering a Tenstorrent acquisition for up to 10 billion dollars: Jim Keller’s AI and RISC-V company in focus 18. June 2026 06:00Samir Bashir 📖 Reading time: approx. 7 minutes · 1,294 words · 8,532 characters An acquisition worth up to ten billion US dollars is not an impulsive purchase between two board meetings, even in the semiconductor industry. Qualcomm i
2026-06-18
www.gadgets360.com 2026-06-18 Gadgets 360
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2026-06-18
ad5.stockfidelity.xyz 2026-06-18 newsline.com
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2026-06-18
mediaselangor.com 2026-06-18 mediaselangor.com
CUPERTINO, June 17 — Apple plans to raise prices on its products to offset increasing memory and storage chip costs, its chief executive officer Tim Cook told the Wall Street Journal (WSJ) in an interview. A surge in artificial intelligence (AI)-driven demand for data centres has forced consumer electronics companies into a fierce competition for dwindling supplies of the key components, driving
2026-06-18
www.thefastmode.com 2026-06-18 The Fast Mode
HPE announced new innovations to help customers transform into agentic enterprises and move AI into production with greater security, governance, and control. These new offerings transform the HPE AI Factory with NVIDIA for the next era of AI where intelligence adapts, evolves, collaborates, and governs. Secure and governed agentic AI gives enterprises the controls needed to move agents from deve
2026-06-18
kalkine.com.au 2026-06-18 Kalkine
Highlights dorsaVi shares rose 2.50% to AUD 0.041 on 18 June 2026, following the release of latest operational update. The company finalised the design package for its first integrated RRAM-CMOS validation chip. The chip was developed with NTU Singapore and ITRI Taiwan. The program now moves toward tape-out and staged silicon implementation. Key features include write-and-verify circuitry, Comput
2026-06-18
markets.ft.com 2026-06-18 Financial Times
IRVINE, Calif. , June 17, 2026 /PRNewswire/ -- Netlist, Inc. (OTCBQ: NLST) today announced it has initiated new legal proceedings against Samsung in the U.S. International Trade Commission (ITC) and the U.S. District Court for the Eastern District of Texas.  These actions are based on the infringement of Netlist'sU.S. Patent Nos. 12,646,537 and 12,650,937, which respectively read on Samsung's high
2026-06-18
gulfnews.com 2026-06-18 Gulf News
Apple’s price hikes may trigger broader tech industry increases amid chip crisis Apple Inc. plans to raise prices on its products to offset surging memory and storage chip costs, CEO Tim Cook told the Wall Street Journal, marking a rare move by the tech giant to pass semiconductor supply pressures directly to consumers amid a tightening global chip shortage. The price increases are expected to h
2026-06-18
news.google.com 2026-06-18 MarkTechPost
2026-06-18
wccftech.com 2026-06-18 Wccftech
SK Hynix has commenced sampling of its next-gen HBM4E memory, offering up to 16 Gbps speeds and 48 GB capacities. The acceleration in AI has pushed DRAM manufacturers to dial up their development plans. As such, SK Hynix is racing its rival Samsung to deliver the first HBM4E memory solutions to partners who will be using it to power their next-generation datacenters. The HBM4E memory will play a
2026-06-18
news.google.com 2026-06-18 University of Hawaii System
2026-06-18
seekingalpha.com 2026-06-18 Seeking Alpha
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2026-06-18
www.newelectronics.co.uk 2026-06-18 New Electronics
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2026-06-18
finimize.com 2026-06-18 Finimize
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2026-06-18
www.koreaherald.com 2026-06-18 The Korea Herald
SK hynix's 12-layer HBM4E, the next-generation high-bandwidth memory chip the company said Thursday it has begun shipping as samples to major customers.(SK hynix)→ SK hynix said Thursday it has shipped samples of its 12-layer HBM4E, the next generation of high-bandwidth memory for artificial intelligence, to major customers, moving the company into the customer-qualification stage roughly thr
2026-06-18
digitimes.com 2026-06-18
Taiyo Yuden is preparing to accelerate production of multilayer ceramic capacitors, or MLCCs, as AI servers and hyperscale data centers tighten supply across the global component market. But the Japanese supplier is resisting the kind of broad price increases now spreading through parts of the industry.
2026-06-18
digitimes.com 2026-06-18
Samsung Electronics is developing and operating a data-sharing platform with semiconductor materials, components and equipment suppliers, according to a report by South Korea's ETNews, which cited industry sources.