www.networkworld.com
2026-05-28
Network World
SK Hynix claims a 30% reduction in thermal resistance for its new chip design integrating cooling inside HBM memory stacks.
SK Hynix has plans to make high-bandwidth memory run cooler than these old chips.
Credit: Gordon Mah Ung
South Korean semiconductor giant SK Hynix has announced a new type of high-bandwidth memory (HBM) for AI datacenters that improves heat dissipation by integrating a cool