Semiconductor News & Analysis Feed
20 articles
2026-08-19
news.google.com
2026-08-19
2026-08-03
www.techradar.com
2026-08-03
2026-07-30
tomshardware.com
2026-07-30
According to a Fubon Research report, Google plans to produce 12 to 15 million TPU v9 chips by 2028, potentially surpassing NVIDIA’s AI GPU shipments in the same period. This marks a significant shift in the AI hardware landscape, as Google’s self-developed chips are rapidly scaling in deployment. T
2026-07-30
www.tomshardware.com
2026-07-30
2026-07-27
news.google.com
2026-07-27
2026-07-24
finance.biggo.com
2026-07-24
AMD unveiled its most powerful AI arsenal to date at the annual AI Advancing event in San Jose, California, featuring the world's first 2nm GPU and a server CPU that benchmarks against or surpasses NVIDIA's offerings. This strategic move positions AMD to reshape the data center competitive landscape
2026-07-24
tomshardware.com
2026-07-24
At AMD's Advancing AI event, the company unveiled its new Instinct MI455X AI accelerator and the Helios rack-scale architecture, marking a significant step toward competing with NVIDIA's NVL72 design. The MI455X features a massive chip with 320 billion transistors, built using advanced packaging and
2026-07-20
tomshardware.com
2026-07-20
As AI models grow increasingly complex, demand for high-performance computing resources has reached unprecedented levels. In response, Microsoft and AMD have announced a partnership to deploy AMD's Helios rack-scale AI accelerator at scale on Azure. The system, built around next-generation Instinct
2026-07-19
www.openpr.com
2026-07-19
2026-07-18
www.servethehome.com
2026-07-18
2026-07-18
www.servethehome.com
2026-07-18
2026-07-15
ca.finance.yahoo.com
2026-07-15
2026-07-10
tomshardware.com
2026-07-10
Samsung is reportedly sampling its dedicated AI processor, codenamed Gaia, with leading PC manufacturers such as HP and Lenovo for next-generation AI PCs. Developed by Samsung's System LSI division, the chip uses a 4nm-class fabrication process and is designed to offload AI workloads from CPUs and G
2026-06-29
technode.global
2026-06-29
NVIDIA and Australian AI firm Firmus Technologies have announced a strategic partnership to deploy up to 170,000 AI accelerators in Indonesia’s Batam campus, aiming for $25–$30 billion in revenue over the first six years. The collaboration leverages Firmus’s HyperCube liquid-cooled AI architecture a
2026-06-25
tomshardware.com
2026-06-25
Qualcomm has announced plans to introduce its full Dragonfly data center product lineup to China, including custom AI accelerators designed to comply with U.S. export thresholds. This move aims to navigate China's unique regulatory environment while leveraging Qualcomm's existing relationships with
2026-06-25
www.constellationr.com
2026-06-25
At its Investor Day, Qualcomm unveiled its latest data center offerings, including the Dragonfly C1000 CPU, High Bandwidth Compute (HBC), and the Dragonfly AI300 inference accelerator. This move signals Qualcomm's intent to challenge NVIDIA in the AI data center market, leveraging efficiency and low
2026-06-25
www.servethehome.com
2026-06-25
At Qualcomm's 2026 Investor Day, the company unveiled a comprehensive strategy for its data center business, including next-generation CPUs, AI accelerators, custom silicon, and connectivity technologies. This event marks Qualcomm's formal entry into the data center market, emphasizing its leadershi
2026-05-27
letsdatascience.com
2026-05-27
Broadcom has expanded its AI hardware ecosystem by partnering with South Korean startup FuriosaAI to develop custom AI accelerators leveraging Broadcom's advanced packaging and networking technologies. According to The Register, FuriosaAI’s third-generation processor will be fabricated on a 2nm node
2026-05-27
www.indexbox.io
2026-05-27
Thermal management has emerged as the primary constraint in high-performance computing and AI accelerator packaging as semiconductor technology advances to more advanced nodes. Modern packaging integrates high-power ASICs with multiple high-bandwidth memory stacks on silicon interposers, creating co
2026-05-26
www.chosun.com
2026-05-26
SK Hynix unveiled its 'iHBM' technology on May 26, 2026, designed to significantly reduce heat generation in high-bandwidth memory (HBM) used in AI accelerators. As AI computing demands rise, HBM chips face increasing thermal loads, leading to performance degradation. The iHBM incorporates an integr