Semiconductor News & Analysis Feed

FuriosaAI and Broadcom have partnered to build a high-performance AI accelerator chip featuring next-gen HBM4/E memory. FuriosaAI has announced its third-generation AI accelerator, which builds upon its 2nd Generation RNGD platform, which is currently in mass production on TSMC's 5nm process technology. The 2nd Gen RNGD AI platform comes in the form of a 180W PCIe-based design, which aims at LLM

AI+ML Broadcom's custom ASIC biz adds South Korea's FuriosaAI to its empire Third-gen chips to use Broadzilla's advanced packaging, networking tech Tobias Mann Systems editor 0 Published Wed 27 May 2026 // 13:00 UTC Broadcom has added FuriosaAI to its list of partners building AI accelerators atop its chip packaging tech. After years quietly serving as the connective tissue behind many modern