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Trending Technologies
EUV15 3nm12 AI accelerators4 AI4 DRAM4 AI chips3 AI data centers3 high-bandwidth memory3 AI infrastructure3 HBM3 memory chips3 advanced packaging3
2026-08-26
LG Chem to showcase AI chip packaging materials at SEMICON Taiwan - The Korea News Plus
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www.newsarticleinsiders.com 2026-08-26
2026-08-25
NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley - Wccftech
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wccftech.com 2026-08-25
2026-08-20
TSMC Turns to Rival Intel for AI Chip Packaging Amid Crunch - Seoul Economic Daily
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en.sedaily.com 2026-08-20
2026-07-31
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging
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digitimes.com 2026-07-31
2026-07-30
TSMC Develops AI Chip Packaging Tech to Counter Intel - The Information
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www.theinformation.com 2026-07-30
2026-07-29
China's glass substrate supply chain takes shape for AI chip packaging
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digitimes.com 2026-07-29
2026-07-24
Amkor Technology, NVIDIA sign multi-year deal to boost U.S. AI chip packaging - Seeking Alpha
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seekingalpha.com 2026-07-24
2026-07-06
Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
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digitimes.com 2026-07-06
2026-06-26
Hanmi Semiconductor debuts FC Bonder 3.5 to power AI chip packaging expansion - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-06-26
HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst
Semiconductor EquipmentAI Chips2.5D PackagingFlip Chip BonderChip Packaging TechnologyHBMGPUCPU
2026-06-25
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
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digitimes.com 2026-06-25
Chinese chip packaging leader JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang. This strategic move strengthens JCET's capacity for AI computing, high-performance chips, and
chip packagingAI chipssemiconductor manufacturingJCETShanghai Lingangadvanced packagingchip testingsmart manufacturing
2026-06-05
Applied Materials Deepens AI Chip Packaging Push As Valuation Stretches - Yahoo Finance
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finance.yahoo.com 2026-06-05
2026-06-03
Naura pushes into AI chip packaging with first 600mm PLP descum tool - digitimes
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www.digitimes.com 2026-06-03
Naura Technology Group's launch of its first 600mm × 600mm panel-level packaging descum tool represents a significant breakthrough in China's semiconductor equipment manufacturing capabilities. This advancement marks the company's strategic shift from wafer-level to panel-level packaging, addressing
Semiconductor EquipmentPackaging TechnologyAI Chips600mmPanel-Level PackagingChinese SemiconductorNaura TechnologyChip Manufacturing
2026-06-02
The AI chip packaging battle intensifies! Taiwan Semiconductor's CoWoS capacity faces strain, prompting Intel's EMIB-T to step in and support Google's TPU supply chain. - 富途牛牛
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news.futunn.com 2026-06-02
2026-05-18
Hanmi Semiconductor Plans US Expansion to Capture Growing AI Chip Packaging Demand - CXO Digitalpulse
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www.cxodigitalpulse.com 2026-05-18
2026-05-06
AI Chip Packaging Constraints Create an Opening for Intel’s EMIB Technology - 24/7 Wall St.
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247wallst.com 2026-05-06
2026-05-04
MediaTek hires former TSMC executive to boost AI chip packaging - Reuters
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www.reuters.com 2026-05-04