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Semiconductor News & Analysis Feed

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Trending Technologies
RTX Spark11 AI9 RISC-V7 Advanced Packaging6 CoWoS5 AI Agents4 Linux driver4 Physical AI4 Terafab3 Omniverse3 SiC3 Silicon Interposer3
2026-10-01
AI chip packaging demand meets labor pushback: ASE's NT$5.6B Taiwan snack factory deal sparks strike vote
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digitimes.com 2026-10-01
2026-09-30
CoWoS-L to Remain Leading AI Chip Packaging Technology Through 2028 - EE Times Asia
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news.google.com 2026-09-30
2026-09-19
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028 - TechPowerUp
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www.techpowerup.com 2026-09-19
2026-09-18
AI Chip Packaging Pushes Beyond Reticle Limits, with CoWoS-L Set to Remain the Mainstream Advanced Packaging Solution Through 2028, Says TrendForce - TrendForce
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www.trendforce.com 2026-09-18
2026-09-03
LCY Advanced Materials launches wet chemicals for AI chip packaging
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digitimes.com 2026-09-03
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Forth.News
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www.forth.news 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - The Mighty 790 KFGO
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kfgo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - KELO-AM
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kelo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WKZO
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wkzo.com 2026-08-27
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - WTVB
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wtvbam.com 2026-08-27
SK Hynix held a groundbreaking ceremony for a $4 billion AI chip packaging facility in West Lafayette, Indiana, marking a major expansion of its U.S. operations amid surging demand for high-bandwidth memory (HBM) driven by artificial intelligence. The facility, expected to begin cleanroom operations
SK HynixAI chipHBM4ESemiconductor manufacturingUS investmentChip packagingArtificial IntelligenceMemory chip
2026-08-27
SK Hynix holds groundbreaking ceremony for $4 billion Indiana AI chip packaging facility - Reuters
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www.reuters.com 2026-08-27
2026-08-26
LG Chem to showcase AI chip packaging materials at SEMICON Taiwan - The Korea News Plus
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www.newsarticleinsiders.com 2026-08-26
2026-08-25
NVIDIA’s CoWoS AI Chip Packaging Demand To Be Foreshadowed In 2027 By AMD Due To Agentic AI CPU Ramp, Says Morgan Stanley - Wccftech
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wccftech.com 2026-08-25
2026-08-20
TSMC Turns to Rival Intel for AI Chip Packaging Amid Crunch - Seoul Economic Daily
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en.sedaily.com 2026-08-20
2026-07-31
Semco reportedly expands SoulBrain partnership to advance glass substrate materials for AI chip packaging
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digitimes.com 2026-07-31
2026-07-30
TSMC Develops AI Chip Packaging Tech to Counter Intel - The Information
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www.theinformation.com 2026-07-30
2026-07-29
China's glass substrate supply chain takes shape for AI chip packaging
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digitimes.com 2026-07-29
2026-07-24
Amkor Technology, NVIDIA sign multi-year deal to boost U.S. AI chip packaging - Seeking Alpha
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seekingalpha.com 2026-07-24
2026-07-06
Asahi Kasei to expand Taiwan photoresist film capacity for AI chip packaging
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digitimes.com 2026-07-06
2026-06-26
Hanmi Semiconductor debuts FC Bonder 3.5 to power AI chip packaging expansion - CHOSUNBIZ - Chosunbiz
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biz.chosun.com 2026-06-26
HANMI Semiconductor unveiled its new equipment, the FC Bonder 3.5, designed for artificial intelligence (AI) system semiconductors on June 26, 2026. This device supports 2.5D packaging, enabling the integration of multiple chips such as GPUs, CPUs, and high bandwidth memory (HBM) onto a single subst
Semiconductor EquipmentAI Chips2.5D PackagingFlip Chip BonderChip Packaging TechnologyHBMGPUCPU