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2026-08-21
JCET's H1 net profit surges 79% on advanced packaging and AI demand - finance.biggo.com
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finance.biggo.com 2026-08-21
2026-08-21
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale
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digitimes.com 2026-08-21
2026-08-21
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
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digitimes.com 2026-08-21
2026-08-20
JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - TradingView
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www.tradingview.com 2026-08-20
2026-08-20
JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - Morningstar
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www.morningstar.com 2026-08-20
2026-08-20
JCET Reports 79.4% YoY Growth in H1 2026 Net Profit Attributable to Shareholders, Accelerates Advanced Packaging Expansion - PR Newswire
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www.prnewswire.com 2026-08-20
2026-08-20
JCET Group : H1 2026 saw strong profit and revenue growth, led by AI and advanced packaging demand - TradingView
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www.tradingview.com 2026-08-20
2026-07-15
JCET forecasts higher first-half profit on AI-driven chip demand
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digitimes.com 2026-07-15
2026-07-10
JCET sets US$1.4bn capex for AI packaging expansion as China orders stay strong
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digitimes.com 2026-07-10
2026-06-27
JCET's US$1.1bn expansion shows where China's AI chip crunch is moving
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digitimes.com 2026-06-27
2026-06-25
China’s JCET to build new plant in Shanghai to expand advanced chip packaging - South China Morning Post
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www.scmp.com 2026-06-25
Chinese chip packaging and testing giant JCET plans to invest 7.8 billion yuan (US$1.15 billion) to build a new advanced packaging and testing facility in Shanghai's Lingang Special Area. This move comes amid rapid growth in domestic chip demand driven by artificial intelligence development. The pro
chip packagingadvanced packagingJCETShanghai plantsemiconductor investmentAI developmentchip manufacturingChinese semiconductors
2026-06-25
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
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digitimes.com 2026-06-25
Chinese chip packaging leader JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang. This strategic move strengthens JCET's capacity for AI computing, high-performance chips, and
chip packagingAI chipssemiconductor manufacturingJCETShanghai Lingangadvanced packagingchip testingsmart manufacturing
2026-06-07
JCET opens 3D packaging plant to target AI power modules, CPO demand
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digitimes.com 2026-06-07