Semiconductor News & Analysis Feed
165 articles
2026-05-29
www.stocktitan.net
2026-05-29
Stock Titan
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2026-05-29
digitimes.com
2026-05-29
MediaTek held its shareholders' meeting on May 29. Addressing the company's future outlook, Chairman Ming-Kai Tsai said that while the mobile phone market in 2026 has performed below expectations due to a sharp rise in memory prices, MediaTek's market share in various connectivity chips has increased significantly. He also noted that the company began generating revenue from AI data centers in 202
2026-05-28
tomshardware.com
2026-05-28
Jowi Morales
Law enforcement agencies are warning that protests over AI and data centers could boil over and turn into civil unrest.
2026-05-28
www.eenewseurope.com
2026-05-28
eeNews Europe
Toshiba has started test-sample shipments of a 1200V trench-gate SiC MOSFET aimed at power supply systems in AI data centres. The TW007D120E is housed in a QDPAK top-side cooled package and is designed to support higher current capability, improved thermal performance and higher power density in the power stage.
2026-05-28
digitimes.com
2026-05-28
On May 27, Marvell Technology reported record revenue in the fiscal first quarter of 2027 and raised its long-term outlook, citing accelerating demand for AI-related data center infrastructure, particularly in high-speed interconnect, Ethernet switching, and custom silicon solutions used in hyperscale cloud deployments.
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
digitimes.com
2026-05-28
Copper clad laminate (CCL) maker Iteq held its 2026 annual general meeting on Thursday, with Chairman Dennis Chen saying that the continued deepening of generative AI applications, faster cloud computing and data center expansion, and steady growth in demand from new energy-related industries are boosting demand for high-end electronic materials and high-frequency, high-speed printed circuit board
2026-05-28
pulse2.com
2026-05-28
Pulse 2.0
Qualcomm and HUMAIN announced a memorandum of understanding to collaborate on next-generation AI data centers, cloud-to-edge infrastructure, and hybrid AI services in Saudi Arabia and global markets. The agreement was signed during the Saudi-US Investment Forum in Riyadh during the visit of U.S. President Donald Trump to Saudi Arabia.
Under the agreement, Qualcomm Technologies and HUMAIN plan to
2026-05-28
www.networkworld.com
2026-05-28
Network World
SK Hynix claims a 30% reduction in thermal resistance for its new chip design integrating cooling inside HBM memory stacks.
SK Hynix has plans to make high-bandwidth memory run cooler than these old chips.
Credit: Gordon Mah Ung
South Korean semiconductor giant SK Hynix has announced a new type of high-bandwidth memory (HBM) for AI datacenters that improves heat dissipation by integrating a cool
2026-05-27
tomshardware.com
2026-05-27
Jowi Morales
Are we going to see another Hollywood movie in the future?
2026-05-27
www.eletimes.ai
2026-05-27
ELE Times
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HomeElectronicsInfineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and...
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Infineon Exhibits Semiconductor Solutions for Power Infrastructure, AI Data Centers, Robotics, and Electromobility at PCIM Europe 2026
ELE Times News
May 27, 2026
PCIM 2026
At PCIM Europe 2026 in Nuremberg
2026-05-27
finance.yahoo.com
2026-05-27
Yahoo Finance
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2026-05-27
digitimes.com
2026-05-27
Qualcomm has reached a deal to supply AI data center chips to ByteDance, giving the US smartphone processor designer a potentially high-volume customer as it tries to expand into AI infrastructure and custom silicon.
2026-05-27
simplywall.st
2026-05-27
simplywall.st
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2026-05-26
ir.microchip.com
2026-05-26
Microchip Technology
Microchip Launches 3.3 kV HV‑D3 mSiC® Power Modules to Enable Solid-State Transformers for AI Data Centers
May 26, 2026 8:00 am EDT
Download as PDF
New silicon carbide modules deliver the required thermal performance and efficiency for SSTs to increase power available for token generation
CHANDLER, Ariz., May 26, 2026 (GLOBE NEWSWIRE) -- Microchip Technology (Nasdaq: MCHP) today announces the ava
2026-05-26
www.tomshardware.com
2026-05-26
Tom's Hardware
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2026-05-26
news.google.com
2026-05-26
Stock Titan
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2026-05-26
digitimes.com
2026-05-26
South Korea and the Netherlands are looking to broaden their semiconductor partnership beyond ASML's EUV lithography machines, as silicon photonics (SiPh) emerges as a potential next field of cooperation amid rising power and bandwidth demands from AI data centers.
2026-05-26
digitimes.com
2026-05-26
Heat management has become a critical challenge as HBM technology advances, with higher stacking and faster speeds to meet surging global demand for AI data processing. Efficient control of power density in the die-to-die physical layer between HBM and GPUs is now central to next-generation HBM competitiveness and data center reliability.
2026-05-25
www.quiverquant.com
2026-05-25
Quiver Quantitative
Pre-Market Momentum: Social media observers noted Qualcomm shares surging more than 11 percent in pre-market action as part of a wider semiconductor rotation. Participants linked the move to growing attention on the firm's expanding role in advanced chip ecosystems. Discussions emphasized how such gains reflect shifting investor focus toward established players with diversified exposure.
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