Semiconductor News & Analysis Feed
2621 articles
2026-06-16
news.google.com
2026-06-16
Business Wire
2026-06-16
tomshardware.com
2026-06-16
Sarah Jacobsson Purewal
I test keyboards for a living, and these are the keyboards I keep coming back to.
2026-06-16
wccftech.com
2026-06-16
Wccftech
The memory requirements of experiencing the entire Siri AI features suite will eventually force Apple to introduce a minimum of 12GB LPDDR5X RAM for its iPhone 18 lineup, but more importantly, is how increased demand for these devices will contribute to the existing memory crisis while making a handful of suppliers wealthy in the process.
2026-06-16
tomshardware.com
2026-06-16
Anton Shilov
Next-generation data center processors from AMD and Intel with 16 DDR5 memory channels are even bigger than today’s designs.
2026-06-16
tomshardware.com
2026-06-16
Jowi Morales
Will Finland be successful in convicting a crew suspected of damaging its undersea infrastructure this time?
2026-06-16
www.axios.com
2026-06-16
Axios
www.axios.com
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2026-06-16
www.communicationstoday.co.in
2026-06-16
Communications Today
www.communicationstoday.co.in
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2026-06-16
www.moomoo.com
2026-06-16
Moomoo
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2026-06-16
news.futunn.com
2026-06-16
富途牛牛
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2026-06-16
tomshardware.com
2026-06-16
Hassam Nasir
Intel's cancelled "Arctic Sound" AI GPU based on the original Xe-HP architecture has been pictured sporting two tiles and 32GB of HBM2E.
2026-06-16
www.milanofinanza.it
2026-06-16
Milano Finanza
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2026-06-16
tomshardware.com
2026-06-16
Etiido Uko
A Reddit user has shown SteamOS running on an Intel Arc B580 desktop GPU, but the early proof of concept required a Radeon-assisted install workaround and Resizable BAR to recover performance.
2026-06-16
semiconductor.samsung.com
2026-06-16
Samsung Semiconductor
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Lam Research, US5128071082
AI wafer demand lifts Lam Research’s Sense.i platform into the spotlight
16.06.2026 - 10:44:18 | ad-hoc-news.de
Lam Research’s Sense.i etch platform is emerging as one of the key workhorses for high-aspect-ratio 3D NAND and advanced logic, as chipmakers ramp AI data center capacity and high-bandwidth memory. The modular system targets lower cost per wafer and tighter pr
2026-06-16
news.google.com
2026-06-16
EE Times
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
www.benzinga.com
2026-06-16
Benzinga
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2026-06-16
www.cnbc.com
2026-06-16
CNBC
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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