Semiconductor News & Analysis Feed
2663 articles
2026-05-29
wtvbam.com
2026-05-29
WTVB
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
whtc.com
2026-05-29
WHTC
By Heekyong Yang
SEOUL, May 29 (Reuters) – Samsung Electronics on Friday said it started shipping samples of its latest high-bandwidth memory (HBM) chip to customers, pulling ahead of rivals in distributing a new version of the product critical to AI data centers and sending its shares higher.
The South Korean tech company said the new chip, the 12-layer HBM4E, is more than 20% faster than its
2026-05-29
www.msn.com
2026-05-29
MSN
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2026-05-29
digitimes.com
2026-05-29
Chinese CMOS image sensor supplier SmartSens Technology announced on May 26 that it has entered into a strategic partnership with Chinese IC design company Unisoc to jointly develop Micro LED-based high-speed optical interconnect technology, targeting applications in AI computing clusters, smart vehicles, and industrial vision.
2026-05-29
digitimes.com
2026-05-29
Oppstar Bhd has restructured the delivery framework of an artificial intelligence chip development project with a Yokohama-based client, replacing an earlier tripartite arrangement with separate design services agreements and formalizing a US$2.9 million contract for its engineering scope, according to The Edge Malaysia.
2026-05-29
digitimes.com
2026-05-29
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI memory product, according to the company. The move underscores intensifying competition among memory suppliers as demand accelerates for higher-performance components used in AI computing systems.
2026-05-29
digitimes.com
2026-05-29
AI demand for high-performance chips is driving up orders for semiconductor silicon capacitors, or Si-Caps, with Samsung Electro-Mechanics and several Taiwanese memory makers emerging as key names to watch. Supply-chain sources say the shift could reshape who captures future demand for advanced packaging.
2026-05-29
digitimes.com
2026-05-29
Genius Electronic Optical (GSEO) held its shareholders meeting on May 29, with chairman Jones Chen and president Ying-Li Guo in attendance. GSEO reported standalone revenue of NT$20.89 billion (approx. US$665.7 million) in 2025, up 13% from NT$18.496 billion in 2024. Consolidated revenue reached NT$24.989 billion, increasing 8% from NT$23.187 billion in 2024. Earnings per share (EPS) came in at NT
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.cnbc.com
2026-05-29
CNBC
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2026-05-29
www.reuters.com
2026-05-29
Reuters
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2026-05-29
news.samsung.com
2026-05-29
samsung.com
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2026-05-29
eetimes.com
2026-05-29
Server architecture will offer up to 100 TB of DRAM per accelerator.
2026-05-29
www.msn.com
2026-05-29
MSN
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2026-05-29
news.google.com
2026-05-29
Stock Titan
2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
247wallst.com
2026-05-29
24/7 Wall St.
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2026-05-29
finance.yahoo.com
2026-05-29
Yahoo Finance
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2026-05-29
www.gurufocus.com
2026-05-29
GuruFocus
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