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2026-05-28
www.stocktitan.net
2026-05-28
Stock Titan
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2026-05-28
www.tradingview.com
2026-05-28
TradingView
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2026-05-28
www.tomshardware.com
2026-05-28
Tom's Hardware
Tech Industry Manufacturing Semiconductors
Chinese university builds 3D chip design tool tailored to Huawei's ‘LogicFolding’ architecture — 3D design delivers increased performance and better thermal management
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By Luke James published 20 minutes ago
China now has a prototype tool designed for vertical circuit stacking.
(Image credit: Getty Images)
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2026-05-28
www.marketbeat.com
2026-05-28
MarketBeat
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2026-05-28
www.prnewswire.com
2026-05-28
PR Newswire
Cenfire Announces Silicon-Based CF2140 MEMS Switch Platform for Semiconductor Test and Measurement Applications
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Cenfire
May 28, 2026, 06:00 ET
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SANTA BARBARA, Calif., May 28, 2026 /PRNewswire/ -- Cenfire today announced sampling availability of its CF2140 MEMS switch platform, a 4-channel SPST switching solution designed to help semiconductor test organ
2026-05-28
www.marketbeat.com
2026-05-28
MarketBeat
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2026-05-28
www.mymalonetelegram.com
2026-05-28
The Malone Telegram
Future Electronics Features Infineon CoolGaN™ Transistors & GaN-Based Solutions for Humanoid Robotics
59 mins ago
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Future Electronics, a global leader in electronic components distribution, is highlighting Infineon Technologies AG CoolGaN™ transistors and GaN-based solutions engineered to support the growing demands of huma
2026-05-28
cryptobriefing.com
2026-05-28
Crypto Briefing
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2026-05-28
digitimes.com
2026-05-28
UMC held its shareholders' meeting on May 27, with CEO Jason Wang saying that as AI applications expand rapidly, long-term semiconductor demand still has room for growth. In addition to deepening its strengths in mature and specialty processes, UMC is also advancing next-generation technologies, including a US-based 12nm FinFET platform, advanced packaging, and silicon photonics, to prepare for fu
2026-05-28
digitimes.com
2026-05-28
Marvell Technology used its first-quarter fiscal 2027 earnings call to detail accelerating progress across optical, copper, and silicon photonics-based connectivity, signaling that AI infrastructure is shifting from compute-centric bottlenecks toward networking-driven architectures. The company's expanded interconnect portfolio, new silicon photonics acquisition, and emerging scale-up switch progr
2026-05-28
digitimes.com
2026-05-28
Passive component manufacturer Yageo held its 2026 annual shareholders meeting on May 27. In a post-meeting interview, chairman Pierre Chen confirmed that the world's two largest multilayer ceramic capacitor (MLCC) makers, Japan's Murata Manufacturing and South Korea's Samsung Electro-Mechanics (Semco), have recently issued price increase notices to customers and distributors.
2026-05-28
digitimes.com
2026-05-28
Advanced Semiconductor Engineering (ASE) has unveiled its industry-first automated panel-level packaging (PLP) system, a development poised to reshape global artificial intelligence (AI) and high-performance computing supply chains by significantly improving chip integration speeds and manufacturing efficiency for AI data centers and cloud infrastructure providers.
2026-05-28
www.ad-hoc-news.de
2026-05-28
AD HOC NEWS
Infineon’s, PCIM
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under the Microscope
27.05.2026 - 22:10:56 | boerse-global.de
Infineon showcases SiC, GaN, and AI data center solutions at PCIM Europe amid a 106% stock surge, signaling a strategic pivot from component maker to complete energy infrastructure partner.
Infineon’s PCIM Showcase Puts the Fuel Behind Its 100% Rally Under t
2026-05-28
247wallst.com
2026-05-28
24/7 Wall St.
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2026-05-28
news.google.com
2026-05-28
The Motley Fool
2026-05-27
seekingalpha.com
2026-05-27
Seeking Alpha
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2026-05-27
www.marketbeat.com
2026-05-27
MarketBeat
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2026-05-27
www.graphene-info.com
2026-05-27
Graphene-Info
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Researchers at Korea's Kumoh National Institute of Technology and Yeungnam University have developed a flexible GaN light-emitting diode (LED) that integrates chemical vapor deposition (CVD) graphene as a transparent current-spreading (TCS) layer on a carbon-supported polyethylene terephthalate (PET) substrate. The device, fabricated using a 2-inch wafer-scale laser lift-off (L
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
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LG Innotek
May 27, 2026, 08:00 ET
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LG Innotek to participate in ECTC for the first time in 2026, joining 135 leading global semiconductor companies
To exhibit two types of large FC‑BGA substrates for AI applications and innovative chip‑embedding
2026-05-27
www.morningstar.com
2026-05-27
Morningstar
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LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at ECTC
Provided by PR Newswire May 27, 2026, 8:00:00 PM
LG Innotek Showcases Next‑Generation Semiconductor Substrate Technologies to Global Big Tech Companies at