Semiconductor News & Analysis Feed
1066 articles
2026-05-27
digitimes.com
2026-05-27
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying the showcase will demonstrate integrated capabilities in AI computing storage, high-speed transmission, and reliable data processing. The firm highlighted that as AI expands to endpoint applications, performance and s
2026-05-27
digitimes.com
2026-05-27
SmartSens and Unisoc have formed a strategic partnership to develop Micro LED high-speed optical interconnects, aiming to deliver domestic, low-power, high-bandwidth solutions for short-reach AI cluster links. The collaboration could accelerate the commercialization of Micro LED co-packaged optics (CPO) technology and strengthen China's role in global AI infrastructure supply chains, according to
2026-05-27
digitimes.com
2026-05-27
WinWay Technology's orders are already booked out five to six months in advance, says company Chairman Mark Wang. He expects new production capacity coming online at the company's Kaohsiung facilities to gradually ease supply shortages and help drive record monthly and quarterly revenue growth throughout the second half of 2026.
2026-05-27
digitimes.com
2026-05-27
Taiwan-based Daxin Materials posted stronger revenue and profitability in 2025 as rapid growth in semiconductor materials offset a still-cautious display market recovery, with AI- and HPC-driven demand emerging as the company's primary growth engine.
2026-05-27
digitimes.com
2026-05-27
US efforts to rebuild its semiconductor supply chain are exposing a critical gap in domestic packaging and testing capacity, a bottleneck that industry sources expect to ease only after 2028 as the US OSAT ecosystem gradually takes shape.
2026-05-27
semiengineering.com
2026-05-27
Gregory Haley
As high-NA EUV approaches, mask makers need new metrics, model-based checks, and curvil...
2026-05-27
digitimes.com
2026-05-27
Wah Lee Industrial said it has formally moved into investments in standard gases and other supplies needed by wafer fabs, with its Tainan logistics center set to open in the second half of 2026 to support future growth. Chairman Gary Chang also confirmed that the company will pass on higher costs for semiconductor and PCB products quarterly as raw material prices climb.
2026-05-27
insurancenewsnet.com
2026-05-27
InsuranceNewsNet
insurancenewsnet.com
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2026-05-27
www.manilatimes.net
2026-05-27
The Manila Times
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.prnewswire.com
2026-05-27
PR Newswire
USI Showcases Advanced SiC Chip-Embedded Packaging Technology at PCIM Europe 2026 APAC - English
NEWS PROVIDED BY
USI
27 May, 2026, 07:00 CST
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~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging
2026-05-27
www.fool.com
2026-05-27
The Motley Fool
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2026-05-27
us.acrofan.com
2026-05-27
acrofan.com
~ Enabling Next-Generation Power Solutions ~
SHANGHAI, May 27, 2026 /PRNewswire/ -- USI, a global leader in electronic design and manufacturing services, today announced a breakthrough in advanced power semiconductor packaging technology designed for next-generation power solutions. Leveraging its innovative substrate and module integration capabilities, USI has successfully embedded silicon carb
2026-05-27
www.cnbc.com
2026-05-27
CNBC
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2026-05-27
news.google.com
2026-05-27
Gizmochina
2026-05-27
semiengineering.com
2026-05-27
Semiconductor Engineering
Researchers from Micron Technology and Argonne National Laboratory have released “Understanding Inference Scaling for LLMs: Bottlenecks, Trade-offs, and Performance Principles”.
Abstract
“The transition from standard generative AI to reasoning-centric architectures, exemplified by models capable of extensive Chain-of-Thought (CoT) processing, marks a fundamental paradigm shift in system requireme
2026-05-27
etfdb.com
2026-05-27
ETF Database
etfdb.com
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2026-05-27
tomshardware.com
2026-05-27
Hassam Nasir
The Arc G3 series would compete directly against AMD's Ryzen Z2 platform.
2026-05-27
www.01net.it
2026-05-27
01net
www.01net.it
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2026-05-26
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2026-05-26
01net
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2026-05-26
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2026-05-26
NVIDIA