SemiPulse — Semiconductor Intelligence

Will Broadcom Joining EPIC Platform Reshape Applied Materials' (AMAT) Advanced Packaging and AI Narrative? - simplywall.st

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simplywall.st 2026-05-23 simplywall.st

Home Portfolios Watchlist Community Discover Screener Sign Up or Login Advertisement United States/Semiconductors/NasdaqGS:AMAT Will Broadcom Joining EPIC Platform Reshape Applied Materials' (AMAT) Advanced Packaging and AI Narrative? May 23, 2026 Simply Wall St Reviewed by Sasha Jovanovic Earlier in May 2026, Applied Materials reported second-quarter sales of US$7.91 billion and net income of US$

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Amkor Showcases Advanced Packaging Growth Strategy at Investor Day - The Globe and Mail

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www.theglobeandmail.com 2026-05-22 The Globe and Mail

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AMD Joins Amkor’s Growing Advanced Packaging Ecosystem - Electronics For You BUSINESS

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www.electronicsforyou.biz 2026-05-22 Electronics For You BUSINESS

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ACM Research (ACMR) Valuation Check As Revenue Growth And Advanced Packaging Wins Support Multi Year Targets - simplywall.st

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simplywall.st 2026-05-22 simplywall.st

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TSMC supply chain material maker AMC rides AI packaging yield boom

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digitimes.com 2026-05-22

Alliance Material Co. (AMC), a Taiwan-based advanced semiconductor materials supplier, said its balance film anti-warpage material has entered customer validation and is expected to begin mass production in the second half of 2026, as AI chip demand drives a new wave of advanced packaging expansion.

Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption

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digitimes.com 2026-05-22

Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers explore panel-based processes. Aaron Fellis, corporate VP and GM of dielectric atomic layer deposition (ALD) products at Lam Research, said leading chip firms are testing PLP in R&D or alliances and that several custome

AP Memory IPD enters Intel's EMIB supply chain, shipments set for 2Q26

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digitimes.com 2026-05-22

Specialty memory design company AP Memory is positioning itself to capture growth momentum from stack silicon capacitors (S-SiCap). The company said its discrete S-SiCap products, also known as discrete silicon capacitors (IPD), will begin small-volume shipments in the second quarter of 2026, making it the first supplier qualified for Intel's embedded multi-die interconnect bridge (EMIB) advanced

AMD deepens China packaging alliance with TF-AMD expansion in Suzhou

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digitimes.com 2026-05-22

AMD CEO Lisa Su appeared in Suzhou on May 20 to attend the launch ceremony for the second-phase expansion of Suzhou TF-AMD Semiconductor Co. (also known as Suzhou Tongfu Advanced Microelectronics), underscoring AMD's growing focus on advanced packaging capacity as AI and high-performance computing demand accelerate globally.

Lam Research launches PLP Center of Excellence, replacing wafers with panels

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digitimes.com 2026-05-22

Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology has drawn significant industry attention. Global semiconductor equipment manufacturer Lam Research announced the official establishment of its PLP Center of Excellence (CoE) in Salzburg, Austria, aimed at streng

Amkor working with AMD on advanced packaging after acquiring more land in Arizona - Reuters

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www.reuters.com 2026-05-22 Reuters

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Amkor working with AMD on advanced packaging after acquiring more land in Arizona - Yahoo Finance

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finance.yahoo.com 2026-05-22 Yahoo Finance

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Amkor working with AMD on advanced packaging after acquiring more land in Arizona - marketscreener.com

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www.marketscreener.com 2026-05-22 marketscreener.com

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