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2026-06-19
eciks.org
2026-06-19
eciks.org
Seok-Hee Lee appointed Intel EVP to lead advanced packaging
Published on 18 June 2026 at 6:18 pm •
Written by Chris Martin
• Reading duration : 2 minutes · read 74 times
© Seok-Hee Lee appointed Intel EVP to lead advanced packaging
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Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, tasking him with leading the company’s advanced packaging, system inte
2026-06-19
wccftech.com
2026-06-19
Wccftech
Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO.
Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, syste
2026-06-19
www.tradingview.com
2026-06-19
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© 2026 Tradi
2026-06-18
simplywall.st
2026-06-18
simplywall.st
United States/Semiconductors/NasdaqGM:ACMR
Is ACM Research’s (ACMR) Advanced Packaging Momentum Quietly Rewriting Its AI Chip Tool Narrative?
June 18, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
In recent days, ACM Research reported strong first-quarter growth, highlighted robust order momentum at its Shanghai subsidiary, and saw semiconductor equipment peers lift expectations for wafer fab eq
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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ACM Research: Advanced Packaging Just Getting Started, Keep Holding Your Gains
Jun 17, 2026, 12:39 PM ETACM Research, Inc. (ACMR) Stock
Gytis Zizys
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ACM Research, Inc. delivered strong Q1 results, with 34% y/y revenue growth and significant outperformance in ECP and Furnace segments.
Gross margins rebounded sequentially to
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.tradingview.com
2026-06-17
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How is Onto Innovation Capitalizing on Advanced Packaging Demand?
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
3 min read
ONTO
+4.38%
Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI comput
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
Shivangi Deora
Wed, June 17, 2026 at 5:10 AM PDT 4 min read
ONTO
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Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its posi
2026-06-17
www.indexbox.io
2026-06-17
IndexBox
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2026-06-17
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2026-06-17
Communications Today
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2026-06-17
www.trendforce.com
2026-06-17
TrendForce
[News] TSMC, Amkor Sign 10-Year Arizona Advanced Packaging Pact to Complete the U.S. Chip Supply Chain
2026-06-17 Semiconductors editor
News
Please note that this article cites information from Amkor, ESM China, and Reuters.
TSMC is strengthening its U.S. advanced packaging supply chain through a new long-term partnership with Amkor. According to an Amkor press release, the two parties h
2026-06-17
www.digitimes.com
2026-06-17
digitimes
Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
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2026-06-17
digitimes.com
2026-06-17
Singapore-based Galatek Technologies is expanding into scarce advanced packaging equipment as it builds localized manufacturing capacity in Malaysia, aiming to capture demand from a shifting global semiconductor supply chain.
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
Lam Research (LRCX) Is Betting On Advanced Packaging For 50% Growth In 2026
Bailey Pemberton
Tue, June 16, 2026 at 1:09 PM PDT 4 min read
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Lam Research is highlighting its advanced packaging business as a key
2026-06-17
www.gurufocus.com
2026-06-17
GuruFocus
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2026-06-16
www.tradingview.com
2026-06-16
TradingView
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Q: AI-driven demand and advanced packaging fuel double-digit growth and deeper OEM partnerships
Q: AI-driven demand and advanced packaging fuel double-digit growth and deeper OEM partnerships
Less than 1 min read
Q
−5.45%
Qnity is capitalizing on AI and advanced packaging trends, driving strong growth in data centers and industrial markets. Its end-to-end materials portfolio, rapi
2026-06-16
www.tradingview.com
2026-06-16
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© 2026 Tradi
2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
sg.finance.yahoo.com
2026-06-16
Yahoo Finance Singapore
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Advanced Packaging Market Size to Worth $106.71 Billion by 2035 | Research by SNS Insider
SNS Insider pvt ltd
Tue, 16 June 2026 at 6:30 am GMT-7 6 min read
SNS Insider pvt ltd
The U.S. Advanced Packaging Market is estimated to be USD 9.66 Billion in 2025 and is projected to reach USD 21.67 Billion by