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2026-07-07
ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging - Business Wire
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news.google.com 2026-07-07 Business Wire
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 - GlobeNewswire
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www.globenewswire.com 2026-07-07 GlobeNewswire
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance UK
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uk.finance.yahoo.com 2026-07-07 Yahoo Finance UK
2026-07-07
Advanced Packaging Technologies Market to Surge Beyond $15 Billion by 2030, Driven by Demand for Compact Electronics - Yahoo Finance
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finance.yahoo.com 2026-07-07 Yahoo Finance
2026-07-07
6G base stations to become AI computing nodes, boosting advanced packaging demand
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digitimes.com 2026-07-07
While there are still years to go for the commercialization of 6G adoption, the next-generation mobile network architecture is increasingly poised to take shape.
2026-07-07
6G base stations to become AI computing nodes, boosting advanced packaging demand - digitimes
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www.digitimes.com 2026-07-07 digitimes
2026-07-06
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips - digitimes
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news.google.com 2026-07-06 digitimes
2026-07-06
Amkor Technology (AMKR) Expected to Benefit From Pivot Toward Advanced Packaging Technologies - Insider Monkey
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news.google.com 2026-07-06 Insider Monkey
2026-07-06
China advanced packaging maker SJ Semiconductor starts US$1.5bn 3DIC project for AI chips
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digitimes.com 2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-05
Tech Outlook: AI, Advanced Packaging Set To Drive New Semiconductor Upcycle - BusinessToday Malaysia
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news.google.com 2026-07-05 BusinessToday Malaysia
2026-07-05
Tech Outlook: AI, Advanced Packaging Set To Drive New Semiconductor Upcycle - BusinessToday Malaysia
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news.google.com 2026-07-05 BusinessToday Malaysia
2026-07-05
Applied Materials unveils integrated tools for HBM, chiplet, and 3D packaging scale-up
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digitimes.com 2026-07-05
Applied Materials announced a new equipment platform aimed at addressing the memory bandwidth and energy-efficiency bottleneck confronting AI computing, unveiling tools across DRAM, advanced packaging, and process control to help chipmakers boost yields and accelerate mass production. The company said the platform combines materials engineering with process integration to support high-bandwidth me
2026-07-04
Kinsus Interconnect Tech outlines its role in advanced packaging. The company positions for long-ter - Ad-hoc-news.de
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www.ad-hoc-news.de 2026-07-04 Ad-hoc-news.de
2026-07-04
Malaysia is well-positioned to benefit from AI semiconductor boom through advanced packaging and supply-chain shift - The Independent Singapore News
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theindependent.sg 2026-07-04 The Independent Singapore News
2026-07-04
Machvision's June revenue hits another record due to AI demand
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digitimes.com 2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-04
The advanced packaging race - KLSE Screener
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www.klsescreener.com 2026-07-04 KLSE Screener
2026-07-04
The advanced packaging race - The Star
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www.thestar.com.my 2026-07-04 The Star
2026-07-03
US Media: Samsung and Anthropic Discuss Collaboration on 2nm AI Chips and Advanced Packaging - thelec.net
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www.thelec.net 2026-07-03 thelec.net
2026-07-03
Intel takes aim at TSMC's CoWoS lead with EMIB-T
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digitimes.com 2026-07-03
As transistor density scaling slows, chipmakers are leaning on advanced packaging to keep improving accelerator performance. A SemiAnalysis roundup of this year's IEEE Electronic Components and Technology Conference described a shift in which Intel, Marvell, TSMC, and others detailed new packaging approaches as packages themselves begin hitting limits.
2026-07-03
SK Hynix puts US$64 billion into Cheongju chip buildout
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digitimes.com 2026-07-03
SK Hynix plans to invest KRW100 trillion (approx. US$64.38 billion) to build new NAND memory chip and advanced packaging facilities in Cheongju, betting that AI demand will keep tightening supply for storage and server memory.