107 articles
2026-05-21
www.thelec.net
2026-05-21
thelec.net
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2026-05-21
futurumgroup.com
2026-05-21
The Futurum Group
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2026-05-21
www.forbes.com
2026-05-21
Forbes
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2026-05-21
digitimes.com
2026-05-21
AMD said on May 21 that it plans to invest more than US$10 billion across Taiwan's semiconductor ecosystem to deepen strategic partnerships and expand advanced packaging capacity for next-generation artificial intelligence (AI) infrastructure. The initiative aims to strengthen manufacturing capabilities, accelerate the deployment of AI systems, and support the growing demand for high-performance c
2026-05-20
electronics360.globalspec.com
2026-05-20
Electronics360
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2026-05-20
electronics360.globalspec.com
2026-05-20
Electronics360
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2026-05-20
www.01net.it
2026-05-20
01net
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2026-05-20
finance.yahoo.com
2026-05-20
Yahoo Finance
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2026-05-20
news.google.com
2026-05-20
Business Wire
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2026-05-20
www.mycarrollcountynews.com
2026-05-20
Carroll County Mirror-Democrat
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2026-05-20
markets.financialcontent.com
2026-05-20
FinancialContent
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2026-05-20
digitimes.com
2026-05-20
China's OSAT providers are trying to move deeper into advanced packaging as artificial intelligence (AI) demand strains global chip packaging supply, creating an opening for companies that have long played a lower-profile role in the semiconductor value chain.
2026-05-19
www.openpr.com
2026-05-19
openPR.com
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2026-05-19
digitimes.com
2026-05-19
China's foundry sector is charting a different course as the global semiconductor market remains focused on AI GPUs, the 2nm process node, and advanced packaging. Led by Semiconductor Manufacturing International (SMIC) and Hua Hong Semiconductor, domestic Chinese foundries have not stalled under US sanctions; instead, they are accelerating efforts to build a China-specific foundry ecosystem amid t
2026-05-18
www.tradingview.com
2026-05-18
TradingView
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2026-05-18
news.futunn.com
2026-05-18
富途牛牛
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2026-05-18
www.digitimes.com
2026-05-18
digitimes
Swancor Holding and RobiChip Technology announced a strategic partnership to accelerate the adoption of advanced packaging materials and heterogeneous chip system integration in robots, robot dogs, and AI-powered platforms, the firms said at the forum on...The article requires paid subscription.Subscribe Now
2026-05-18
simplywall.st
2026-05-18
simplywall.st
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2026-05-17
www.indexbox.io
2026-05-17
IndexBox
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2026-05-17
digitimes.com
2026-05-17
Singapore-based AI automation startup Galatek said it is tackling yield bottlenecks in micron-level packaging with AI-embedded equipment as demand for AI and high-performance computing (HPC) chips surges across Southeast Asia and global markets. The company is also pursuing a dual-track expansion spanning Southeast Asia and Taiwan.