Semiconductor News & Analysis Feed
321 articles
2026-06-19
tomshardware.com
2026-06-19
Luke James
Intel has appointed Seok-Hee Lee, the former chief executive of memory maker SK hynix and battery maker SK On, as executive vice president of Intel Foundry.
2026-06-19
www.koreaherald.com
2026-06-19
The Korea Herald
Lee Seok-hee, executive vice president of Intel Foundry (Intel)
Intel has appointed former CEO of SK hynix and SK On Lee Seok-hee as a senior vice president in its foundry business, amid the US chipmaker’s push into advanced semiconductor packaging.
Intel announced Thursday that Lee will oversee advanced packaging, system integration, back-end technology development and back-end manufacturing at
2026-06-19
www.benzinga.com
2026-06-19
Benzinga
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2026-06-19
pulse.mk.co.kr
2026-06-19
매일경제
U.S. semiconductor company Intel Corp. has appointed former SK hynix Inc. President Lee Seok-hee as executive vice president of Intel Foundry.
In a press release issued on Thursday, local time, Intel announced that Lee would join the company as executive vice president of its foundry business. He will report directly to Chief Executive Officer (CEO) Lip-Bu Tan.
Lee will oversee advanced packagin
2026-06-19
pulse.mk.co.kr
2026-06-19
매일경제
U.S. semiconductor company Intel Corp. has appointed former SK hynix Inc. President Lee Seok-hee as executive vice president of Intel Foundry.
In a press release issued on Thursday, local time, Intel announced that Lee would join the company as executive vice president of its foundry business. He will report directly to Chief Executive Officer (CEO) Lip-Bu Tan.
Lee will oversee advanced packagin
2026-06-19
www.bizjournals.com
2026-06-19
The Business Journals
www.bizjournals.com
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2026-06-19
www.asiae.co.kr
2026-06-19
아시아경제
Korean Semiconductor Veteran with Memory and Manufacturing Expertise Joins Intel
Intel Steps Up the Chase Against TSMC and Samsung
Intel-Apple Collaboration Gains Momentum
Seokhee Lee, former CEO of SK hynix and SK On, has joined Intel, the American semiconductor company, as a key executive in its foundry business. With speculation about potential collaboration between Apple and Intel, industry o
2026-06-19
biz.chosun.com
2026-06-19
Chosunbiz
By
Jeong Du-yong
Published 2026.06.19. 09:49
Former SK hynix CEO Lee Seok-hee. /Courtesy of SK On
Intel has hired former SK hynix CEO (president) Lee Seok-hee as executive vice president of the foundry (semiconductor contract manufacturing) institutional sector. Lee, who also served as SK On CEO (president), is regarded as a veteran in Korea's semiconductor and manufacturing industries. In April
2026-06-19
mezha.net
2026-06-19
mezha.net
Intel appoints Seok Hee Lee to lead advanced packaging and contract manufacturing
Friday, 19 June 2026, 02:32
Intel tapped a seasoned chip industry leader to drive its packaging and system integration push, aiming to rebuild foundry momentum and speed deployment of 18A and 14A nodes.
As mentioned by Reuters
On June 18, Intel named Seok-Hee Lee as executive vice president of its contract chip ma
2026-06-19
marklapedus.substack.com
2026-06-19
Semiecosystem
Intel Names New Advanced Packaging Chief
Intel has reorganized its foundry unit, naming a new executive to lead its packaging business
SEMIECOSYSTEM
JUN 19, 2026
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By Mark LaPedus
Intel has reorganized its foundry unit and appointed a new executive to lead its efforts in the advanced packaging business.
Seok-Hee Lee, formerly president and chief executive of SK On, has been appointed a
2026-06-19
eciks.org
2026-06-19
eciks.org
Seok-Hee Lee appointed Intel EVP to lead advanced packaging
Published on 18 June 2026 at 6:18 pm •
Written by Chris Martin
• Reading duration : 2 minutes · read 74 times
© Seok-Hee Lee appointed Intel EVP to lead advanced packaging
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Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, tasking him with leading the company’s advanced packaging, system inte
2026-06-19
wccftech.com
2026-06-19
Wccftech
Intel has hired Seok-Hee Lee as EVP of its Foundry's Advanced Packaging & Back-End Technology, bringing years of experience from SK Hynix, where he served as President and CEO.
Press Release: Intel Corporation today announced the appointment of Seok-Hee Lee as executive vice president of Intel Foundry, reporting directly to CEO Lip-Bu Tan. In this role, Lee will lead all advanced packaging, syste
2026-06-19
www.tradingview.com
2026-06-19
TradingView
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2026-06-18
simplywall.st
2026-06-18
simplywall.st
United States/Semiconductors/NasdaqGM:ACMR
Is ACM Research’s (ACMR) Advanced Packaging Momentum Quietly Rewriting Its AI Chip Tool Narrative?
June 18, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
In recent days, ACM Research reported strong first-quarter growth, highlighted robust order momentum at its Shanghai subsidiary, and saw semiconductor equipment peers lift expectations for wafer fab eq
2026-06-18
seekingalpha.com
2026-06-18
Seeking Alpha
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ACM Research: Advanced Packaging Just Getting Started, Keep Holding Your Gains
Jun 17, 2026, 12:39 PM ETACM Research, Inc. (ACMR) Stock
Gytis Zizys
4.48K Followers
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ACM Research, Inc. delivered strong Q1 results, with 34% y/y revenue growth and significant outperformance in ECP and Furnace segments.
Gross margins rebounded sequentially to
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.theglobeandmail.com
2026-06-17
The Globe and Mail
Onto Innovation Inc.ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI compute applications. On the last earnings call, management highlighted that strong demand for AI compute is driving momentum across both front-end and advanced packaging, contri
2026-06-17
www.tradingview.com
2026-06-17
TradingView
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How is Onto Innovation Capitalizing on Advanced Packaging Demand?
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
3 min read
ONTO
+4.38%
Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its position across high-performance AI comput
2026-06-17
finance.yahoo.com
2026-06-17
Yahoo Finance
How is Onto Innovation Capitalizing on Advanced Packaging Demand?
Shivangi Deora
Wed, June 17, 2026 at 5:10 AM PDT 4 min read
ONTO
+4.23%
AMAT
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KLAC
+3.70%
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Onto Innovation Inc. ONTO is capitalizing on rising advanced packaging demand by expanding its inspection and metrology portfolio, accelerating new product adoption and strengthening its posi
2026-06-17
www.indexbox.io
2026-06-17
IndexBox
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