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2026-06-16
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TSMC and Amkor Technology Announce Long Term Partnership to Accelerate Advanced Packaging in the United States
Business Wire
Tue, 16 June 2026 at 6:00 am GMT-7 4 min read
2330.TW
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+1.30%
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HSINCHU, Taiwan & TEMPE, Ariz., June 16, 2026--(BUSINESS WIRE)--Taiwan Semiconductor Manufact
2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
technode.global
2026-06-16
TNGlobal
Kenanga Research said Monday that advanced packaging will become the next battleground in semiconductor value chain and benefit Malaysia’s technology players.
The research house said in a note that advanced packaging has emerged as a critical enabler of next-generation semiconductor performance, particularly as Moore’s Law slows and artificial intelligence (AI)/ high performance computing (HPC) w
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
ASE Tech, TW0003711008
New high-density fan-out module, ASE Technology pushes advanced packaging for AI chips
16.06.2026 - 03:43:12 | ad-hoc-news.de
ASE Technology is highlighting its FOCoS fan-out module as a high-density packaging option for AI and data center processors, combining multiple dies and high-bandwidth memory in a single advanced substrate stack for hyperscale and HPC customers.
AS
2026-06-16
digitimes.com
2026-06-16
Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor Equipment Market Statistics report from SEMI.
2026-06-16
digitimes.com
2026-06-16
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS toward CoPoS as it builds out a fuller ecosystem ahead of rivals.
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
AI packaging push: how TSMC’s CoWoS advanced packaging is scaling for the next wave
15.06.2026 - 19:54:24 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging platform is at the center of the AI accelerator boom. Capacity for the 2.5D chip-on-wafer-on-substrate technology is ramping hard, with the foundry targeting well over 100,000 wafers per month as hyperscaler demand keeps clim
2026-06-15
simplywall.st
2026-06-15
simplywall.st
United States/Semiconductors/NasdaqGS:AMKR
Amkor Technology (AMKR) Is Up 21.2% After Outlining AI-Focused Advanced Packaging Expansion Strategy
June 15, 2026
Simply Wall St
Reviewed by Sasha Jovanovic
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Amkor Technology recently reported record Q1 2026 revenue and used its first Investor Day in nearly 20 years to outline ambitious long-term growth targets anchored in advanced packagi
2026-06-15
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2026-06-15
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2026-06-15
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2026-06-15
Focus Malaysia
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2026-06-15
BusinessToday Malaysia
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2026-06-15
www.digitimes.com
2026-06-15
digitimes
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes...
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2026-06-15
digitimes.com
2026-06-15
Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical deposition (ECD) mass-production tool, further expanding its footprint in advanced packaging process equipment and demonstrating integrated capabilities spanning in-house R&D, process and system integration, and mass-production deployment.
2026-06-15
digitimes.com
2026-06-15
As global semiconductor supply chains are rebuilt, Southeast Asia is evolving from a back-end test-and-pack region into a resilient, multi-center advanced packaging and equipment ecosystem, according to industry participants. Migration drivers include pushes for local production and service, faster ramps for AI chip capacity, and customer demands for supply chain resilience amid de-Americanization