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2026-06-16
TSMC Partners With Ibiden and Innolux to Advance Glass Substrate Packaging Technology; CoPoS Advanced Packaging Validation Data Revealed for the First Time - TradingKey
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www.tradingkey.com 2026-06-16 TradingKey
2026-06-16
Qualcomm’s Reported Tenstorrent Talks Test Lofty Valuation And AI Ambitions - Yahoo Finance
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finance.yahoo.com 2026-06-16 Yahoo Finance
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Morningstar
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www.morningstar.com 2026-06-16 Morningstar
2026-06-16
Infineon Highlights USB Advances for AI PCs, Embedded Vision, and Edge Computing - EE Times Asia
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news.google.com 2026-06-16 EE Times Asia
2026-06-16
Li Auto launches new-gen cockpit platform powered by proprietary OS, Qualcomm's latest chip - Gasgoo
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autonews.gasgoo.com 2026-06-16 Gasgoo
2026-06-16
Nvidia’s $25 Billion Bond Sale Is Bigger Than a Cash Raise - Barchart.com
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www.barchart.com 2026-06-16 Barchart.com
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - bastillepost.com
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www.bastillepost.com 2026-06-16 bastillepost.com
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - The Joplin Globe
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www.joplinglobe.com 2026-06-16 The Joplin Globe
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Bluefield Daily Telegraph
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www.bdtonline.com 2026-06-16 Bluefield Daily Telegraph
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Caledonian Record
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www.caledonianrecord.com 2026-06-16 Caledonian Record
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Business Wire
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news.google.com 2026-06-16 Business Wire
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - mykxlg.com
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www.mykxlg.com 2026-06-16 mykxlg.com
2026-06-16
Murata Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - Yahoo Finance Singapore
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sg.finance.yahoo.com 2026-06-16 Yahoo Finance Singapore
2026-06-16
From CoWoS to CoPoS, Taiwan Semiconductor's glass substrate verification has broken through the packaging performance bottleneck. - Moomoo
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www.moomoo.com 2026-06-16 Moomoo
2026-06-16
Murata Manufacturing : Collaborates with Synopsys to Provide Simulation Models Through Ansys Electromagnetic and Thermal Analysis Tools - marketscreener.com
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www.marketscreener.com 2026-06-16 marketscreener.com
2026-06-16
RAM Benchmark Hierarchy 2026: DDR5, DDR4 for AMD, Intel CPUs
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tomshardware.com 2026-06-16 Zhiye Liu
Our RAM benchmark hierarchy ranks DDR5 and DDR4 memory kits of all frequencies and capacities for any budget.
RAM performanceDDR5DDR4Intel CPUAMD CPUmemory benchmarkmemory speedmemory latency
2026-06-16
Why Micron Stock Rocketed to a Record High Today - The Globe and Mail
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www.theglobeandmail.com 2026-06-16 The Globe and Mail
2026-06-16
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing
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digitimes.com 2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
AI chip race sends WF6 prices soaring after Japan supply shock
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digitimes.com 2026-06-16
Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used in semiconductor manufacturing. Limited short-term supply additions and low industry inventories are widening the supply-demand gap, triggering a rapid price increase.
2026-06-16
Rapidus signs UK chip pact in push for 2nm customers
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digitimes.com 2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.