Semiconductor News & Analysis Feed
302 articles
2026-07-08
www.ad-hoc-news.de
2026-07-08
AD HOC NEWS
2026-07-08
timesofindia.indiatimes.com
2026-07-08
The Times of India
2026-07-08
digitimes.com
2026-07-08
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor supply chain. As ASE boosts capacity to meet TSMC-linked demand, Hanmi is positioning for broader sales growth in the second half of 2026 and beyond.
2026-07-08
tomshardware.com
2026-07-08
Jeffrey Kampman
More memory, more performance, more power. Maybe.
2026-07-07
www.ad-hoc-news.de
2026-07-07
AD HOC NEWS
2026-07-07
tomshardware.com
2026-07-07
Anton Shilov
Kioxia, Sandisk begin to sample BiCS10 3D NAND: 332 active layers and over 29 Gb/mm2 areal capacity.
2026-07-07
news.google.com
2026-07-07
CXO Digitalpulse
2026-07-07
digitimes.com
2026-07-07
China memory makers are diverging in their outlook as AI demand keeps the global memory market tight. After GigaDevice recently issued an unusual risk warning, Beijing-based special memory and embedded processor maker Ingenic said global DRAM foundry capacity remains broadly constrained and is unlikely to improve before the second half of 2027.
2026-07-07
digitimes.com
2026-07-07
Nvidia and other artificial intelligence chipmakers are still facing shortages as TSMC's advanced-node and CoWoS packaging capacity remains tight, pushing demand into foundries, back-end assembly, testing, and overseas fabs. The strain is creating spillover opportunities across the broader semiconductor supply chain, while also exposing how dependent the market has become on limited high-end capac
2026-07-07
digitimes.com
2026-07-07
AI server demand is lifting shipments of motor-related power devices at Cystech Electronics, helping the Taiwanese MOSFET and diode designer grow first-half 2026 revenue despite memory shortages weighing on networking products. Wafer foundry and packaging capacity remain tight, with rush orders pushing standard lead times from 180 days to 270 days, according to supply chain sources.
2026-07-06
digitimes.com
2026-07-06
Meta is reportedly exploring a new AI cloud infrastructure business that would let enterprises use its AI models and some unused GPU capacity, a move that could lift hardware utilization and create a new revenue stream from its heavy artificial intelligence spending. The proposal has revived talk of an AI bubble, but key industry barometers Nvidia and TSMC still show no sign of a broad demand slow
2026-07-06
digitimes.com
2026-07-06
SJ Semiconductor has started construction of a CNY10 billion (approx. US$1.47 billion) 3DIC manufacturing project in Shanghai's Lingang New Area, expanding advanced packaging capacity for high-performance computing, AI and data center chips.
2026-07-06
digitimes.com
2026-07-06
China's leading semiconductor equipment manufacturers are accelerating expansion through acquisitions and fundraising, as surging AI investment, memory chip capacity growth, and import substitution combine to create one of the industry's strongest growth cycles in years.
2026-07-06
digitimes.com
2026-07-06
Asahi Kasei, one of the notable suppliers of Sunfort dry film photoresist in Japan, has initiated a fab expansion project in Taiwan. The newly established plant is expected to further elevate capacity performance in cutting and processing semiconductor packaging substrates.
2026-07-06
digitimes.com
2026-07-06
LandMark Optoelectronics (LMOC) posted record-high single-month revenue in June 2026 and is stepping up its expansion plans to prepare for demand beyond 2028, as silicon photonics (SiPh) revenue is expected to triple in 2026. The optical communications epitaxial wafer (epi-wafer) maker said revenue rose for the eleventh consecutive month, reflecting tighter capacity and stronger data center demand
2026-07-05
news.google.com
2026-07-05
CPG Click Oil and Gas
2026-07-05
news.google.com
2026-07-05
Ad-hoc-news.de
2026-07-04
digitimes.com
2026-07-04
Machvision posted another record monthly revenue in June 2026, as surging demand for AI servers, high-performance computing (HPC), and advanced packaging continued to lift orders for the semiconductor and PCB inspection equipment maker. The company said the biggest challenge has now shifted from winning orders to managing supply chains and expanding capacity.
2026-07-03
www.gasworld.com
2026-07-03
gasworld
2026-07-03
finance.yahoo.com
2026-07-03
Yahoo Finance