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This year’s EE Times Chiplets event will address challenges in the design flow and chiplet technologies to enable straightforward scaling.

Costs can rise with chiplets. Will that change? Will it matter?

Warpage, heat, and brittleness can cause huge reliability problems for expensive designs.

Key Takeaways:Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability.Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out.AI is beginning to

Multi-die assemblies are facing full system-level challenges, but engineering teams nee...

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The startup has ditched multi-vendor chiplets for a powerful in-house design, promising safety, scalability, and aggressive pricing.

Complex chips need coherent and non-coherent sub-NoCs to ensure efficient data paths. C...