Semiconductor News & Analysis Feed
245 articles
2026-06-18
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2026-06-18
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2026-06-18
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2026-06-18
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As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square."...
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2026-06-18
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2026-06-18
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Samsung Foundry’s MPW service allows multiple chip designs to share a single wafer for prototype production. Credit: Samsung
Samsung Electronics' foundry division plans to open its Multi-Project Wafer, or MPW, service to its 2nm process next year, giving South Korean fabless chip designers access to one of the most advanced foundry nodes being commercialized without having to pay...
2026-06-18
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2026-06-18
Beyond its established role in assembly, testing and packaging (ATP), Penang's next stage of development will depend on its ability to deepen capabilities in precision engineering, automation and system integration, while moving into higher-value equipment manufacturing and R&D. Following the opening of Galatek's new facility in Penang, Malaysia, DIGITIMES spoke with Galatek Malaysia general manag
2026-06-18
digitimes.com
2026-06-18
As AI chip technology advances, larger chip sizes and heterogeneous integration packaging are driving bigger package dimensions, pushing semiconductor makers to adopt FOPLP over FOWLP and improve manufacturing efficiency by "replacing round with square." DIGITIMESbelieves that panel makers have an edge because their existing glass substrates are larger than those used by OSATs, making FOPLP develo
2026-06-18
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2026-06-18
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SK Hynix has eliminated degree requirements from its regular recruitment process for new employees, as the memory chip giant seeks to strengthen its lead in high-bandwidth memory (HBM) and secure talent for the fast-changing AI semiconductor market. Industry...
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2026-06-17
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2026-06-17
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Li Auto announced details of its new Mach M100 chip, a self-developed 5nm chip focused on autonomous driving, on June 15. This development marks the latest entry among Chinese automakers into designing in-house chips as they compete on cost and smart-driving...
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2026-06-17
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2026-06-17
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InnoScience Technology, a leading China-based integrated device manufacturer (IDM) in gallium nitride (GaN), has won a sweeping victory in the latest patent ruling against global power component leader Infineon in China. Supply-chain sources said the two...
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2026-06-17
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2026-06-17
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Semiconductor manufacturers, market analysts, and engineering departments have long tracked the clean energy transition through siloed vertical markets. For example, they will calculate individual EV sales on one spreadsheet while tracking hyperscale data...
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2026-06-17
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2026-06-17
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AI infrastructure is increasingly dependent on light, and more of that technology is being built in Texas. Coherent's new Sherman expansion, backed by public and private funding, could strengthen global supply chains for the lasers and optical components that...
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2026-06-17
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2026-06-17
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Taiwan Semiconductor Manufacturing Company (TSMC) and Amkor Technology have signed a 10-year agreement to jointly expand advanced semiconductor packaging capacity in Arizona, a move that would bring a more complete chip supply chain onto American soil.
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2026-06-16
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2026-06-16
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Nvidia launched a sale of US$25 billion worth of high-grade bonds on June 15, ultimately garnering up to US$85 billion in orders, or more than triple the bond's original size. This is one of several debt offerings this year from tech giants, which are...
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2026-06-16
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2026-06-16
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ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and...
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2026-06-16
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2026-06-16
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Global semiconductor manufacturing equipment sales reached a record US$36.55 billion in the first quarter of 2026, driven by AI-related investment in advanced logic, DRAM, and advanced packaging capacity, according to the latest Worldwide Semiconductor...
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2026-06-16
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2026-06-16
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2026-06-16
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2026-06-16
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On June 15, Synopsys celebrated the 35th anniversary of its Taiwan operations and officially opened its new office at Hsinchu Science Park X Software Park.
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2026-06-16
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2026-06-16
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Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible through Synopsys' Ansys HFSS and Ansys Icepak environments, simplifying engineers' workflows as they develop increasingly...
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2026-06-16
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2026-06-16
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The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC...
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2026-06-16
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2026-06-16
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TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
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2026-06-16
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Nvidia's dominance in AI is extending beyond model training and deeper into inference—the fast-growing segment of the AI market responsible for running deployed models and generating revenue.
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