Semiconductor News & Analysis Feed
315 articles
2026-06-29
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2026-06-29
digitimes
Infineon and Innoscience are locked in a global legal battle over alleged infringement involving gallium nitride (GaN) technology, with courts across multiple jurisdictions becoming battlegrounds for the dispute. In China, Innoscience appears to have gained...
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2026-06-28
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2026-06-28
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As advanced semiconductor processes rapidly transition from 28nm to 3nm and 2nm nodes, more frequent chemical cleaning procedures are driving an increase in demand for liquid chemical waste treatment. Techzone Chairman Chen Li-Li said that semiconductor...
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2026-06-27
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2026-06-27
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Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean equipment maker looks to broaden its advanced packaging business beyond TC bonders for high-bandwidth memory and supply...
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2026-06-26
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2026-06-26
digitimes
Infineon and Innoscience are locked in a global legal battle over alleged infringement involving gallium nitride (GaN) technology, with courts across multiple jurisdictions becoming battlegrounds for the dispute. In China, Innoscience appears to have gained...
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2026-06-26
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2026-06-26
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Qualcomm has unveiled its latest AI data center platform, Dragonfly, at its annual investor day, highlighting a new technology it calls High Bandwidth Compute, or HBC, as a key weapon in its challenge to Nvidia, AMD and AI chip startups.
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2026-06-26
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2026-06-26
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Tai Asia Semiconductor's latest annual meeting highlighted a broader shift that could matter for investors and technology supply chains worldwide. The company said it is absorbing short-term losses to fund new businesses, while its subsidiaries advance in...
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2026-06-26
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2026-06-26
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Onsemi has agreed to buy Synaptics in an all-stock transaction valued at about US$7 billion, a deal that could reshape the edge AI landscape across automotive, industrial, and connected devices. If completed, the merger aims to broaden global access to...
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2026-06-26
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2026-06-26
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China's power semiconductor makers are lifting prices again as demand from artificial intelligence (AI) servers and new energy vehicles strengthens. The moves may signal a broader industry upcycle with global implications, as higher costs and tighter capacity...
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2026-06-25
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2026-06-25
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Micron Technology is turning the AI memory boom into a new Wall Street story: not just record DRAM, NAND and HBM demand, but stronger free cash flow, long-term customer commitments and a clearer path to shareholder returns.
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2026-06-25
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2026-06-25
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As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics' foundry business, with its 2028 turnaround target hinging on stable operations...
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2026-06-24
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2026-06-24
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Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond the standard Galaxy S27 and S27 Plus models and into the premium Galaxy S27 Ultra and Galaxy Z Fold 8, according to...
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2026-06-24
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2026-06-24
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Samsung Electronics is putting long-term memory supply agreements higher on its second-half agenda as demand from data centers broadens beyond high-bandwidth memory, or HBM, into server DRAM and storage products.
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2026-06-23
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2026-06-23
digitimes
Infineon and InnoScience are escalating their global GaN patent dispute across the US, Germany, and China, with each side scoring wins in infringement suits that are already affecting real-world sales. Sources familiar with the matter say the latest rulings...
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2026-06-23
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2026-06-23
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SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over whether its safety management system has gaps. The incidents have drawn scrutiny because many occurred after the M15X fab...
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2026-06-23
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2026-06-23
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SK Hynix's semiconductor production base in Cheongju, South Korea, has seen a string of accidents since 2026, prompting questions over whether its safety management system has gaps. The incidents have drawn scrutiny because many occurred after the M15X fab...
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2026-06-23
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2026-06-23
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Wafer Works announced after its June 18, 2026, shareholders meeting that it launched a "golden triangle" expansion plan to deepen silicon wafer product lines and support fast-growing applications in advanced packaging, optical transmission and...
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2026-06-22
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2026-06-22
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Former SK Hynix CEO Lee Seok-Hee is set to return to Intel as executive vice president (EVP) of Intel's foundry business, strengthening Intel's push into advanced packaging technologies. The appointment also represents another strategic move by Intel CEO...
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2026-06-22
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2026-06-22
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SK Hynix briefly overtook Samsung Electronics on June 22 to claim the top spot by common-share market capitalization on South Korea's KOSPI exchange, a milestone that reflects how high-bandwidth memory (HBM) has redefined the value of Korea's semiconductor...
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2026-06-22
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2026-06-22
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The race to commercialize glass core substrates in advanced semiconductor packaging is heating up — but the technology is moving faster in headlines than in production lines. DIGITIMES has been tracking the latest developments in TSMC's CoPoS...
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2026-06-22
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2026-06-22
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TSMC is accelerating its CoPoS rollout, replacing traditional round wafers with larger rectangular glass panels to support packaging demand for AI GPUs and HPC chips over the next several years. Supply chain sources said the first wave of demo equipment has...
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