Semiconductor News & Analysis Feed
8248 articles
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Lam Research, US5128071082
AI wafer demand lifts Lam Research’s Sense.i platform into the spotlight
16.06.2026 - 10:44:18 | ad-hoc-news.de
Lam Research’s Sense.i etch platform is emerging as one of the key workhorses for high-aspect-ratio 3D NAND and advanced logic, as chipmakers ramp AI data center capacity and high-bandwidth memory. The modular system targets lower cost per wafer and tighter pr
2026-06-16
news.google.com
2026-06-16
MarketBeat
2026-06-16
finance.yahoo.com
2026-06-16
Yahoo Finance
The Zacks Analyst Blog Highlights SanDisk, Micron, Seagate Technology and Western Digital
The Zacks Analyst Blog Highlights SanDisk, Micron, Seagate Technology and Western Digital · Zacks
Zacks Equity Research
Tue, June 16, 2026 at 1:28 AM PDT 8 min read
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2026-06-16
seekingalpha.com
2026-06-16
Seeking Alpha
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2026-06-16
focustaiwan.tw
2026-06-16
Focus Taiwan
Taipei, June 16 (CNA) Liao Cheng-wei (廖承威), director general of Taiwan's Intellectual Property Office (TIPO), said on Tuesday that he suspected two firms currently suing contract chipmaker Taiwan Semiconductor Manufacturing Co. (TSMC) for patent infringement are so-called "patent trolls."
When asked whether TIPO has knowledge of the details of the case filed with the U.S. International Trade Comm
2026-06-16
news.google.com
2026-06-16
TradingView
2026-06-16
stockstory.org
2026-06-16
StockStory
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2026-06-16
www.digitimes.com
2026-06-16
digitimes
On June 15, Synopsys celebrated the 35th anniversary of its Taiwan operations and officially opened its new office at Hsinchu Science Park X Software Park.
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2026-06-16
www.tweaktown.com
2026-06-16
TweakTown
US AI startup Tensordyne claims 3nm Napier chip outperforms NVIDIA Blackwell by 13x in tokens per second
The TDN72 rack houses 288 Napier chips, delivers 608 petaflops of FP8 compute, and claims to match the throughput of nine NVIDIA Rubin plus Groq LPX racks.
VIEW GALLERY - 3
Hassam Nasir
Tech Reporter
Published Jun 16, 2026 12:15 AM CDT
1 minute & 45 seconds read time
TL;DR: Tensordyne's 3nm N
2026-06-16
www.digitimes.com
2026-06-16
digitimes
TSMC is accelerating its advanced packaging roadmap for AI chips, expanding CoWoS capacity while publicly disclosing new progress in glass substrate technology. The company is also signaling that next-generation packaging competition is shifting from CoWoS...
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2026-06-16
drrobertcastellano.substack.com
2026-06-16
Dr. Robert Castellano's Semiconductor Deep Dive Newsletter
AI Is No Longer Limited by Transistors. It Is Becoming Limited by Package Area
DR. ROBERT CASTELLANO
JUN 16, 2026
∙ PAID
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What’s In This Article
The Next AI Bottleneck Has Arrived
Chart 1. CoWoS and CoPoS Cost Crossover
Why CoWoS Is Reaching Its Limits
Table 1. Evolution of TSMC Advanced Packaging Technologies
CoPoS Expands Package Area by More Than 5x
Table 2. CoWoS Versus CoPoS
Panel-Leve
2026-06-16
www.gurufocus.com
2026-06-16
GuruFocus
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2026-06-16
evertiq.com
2026-06-16
Evertiq
© Air Liquide
Electronics Production | June 16, 2026
Air Liquide invests €200M in Korea to back SK hynix’s AI chip project
Evertiq
In order to supply SK hynix’s new packaging and testing fab “P&T7”, located in Cheongju, in the Chungcheongbuk province, Air Liquide will build and operate a state-of-the-art nitrogen production unit.
France’s Air Liquide has signed a long-term contract with SK hynix.
2026-06-16
www.igorslab.de
2026-06-16
igor´sLAB
LATEST NEWS
Cadence and Intel Foundry deepen 14A partnership: The real battle begins with the PDK
16. June 2026 06:00Samir Bashir
📖 Reading time: approx. 6 minutes · 1,019 words · 6,600 characters
One can say very grand things about new process nodes. “Angstrom,” “High-NA EUV,” “AI foundry,” “leadership” – the industry has enough vocabulary to turn a process node into almost a religious experienc
2026-06-16
www.igorslab.de
2026-06-16
igor´sLAB
LATEST NEWS
Cadence and Intel Foundry deepen 14A partnership: The real battle begins with the PDK
16. June 2026 06:00Samir Bashir
📖 Reading time: approx. 6 minutes · 1,019 words · 6,600 characters
One can say very grand things about new process nodes. “Angstrom,” “High-NA EUV,” “AI foundry,” “leadership” – the industry has enough vocabulary to turn a process node into almost a religious experienc
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Suess Microtec, DE000A1K0235
New release push: Suess Microtec’s XBC300 Gen2 targets advanced packaging demand
16.06.2026 - 05:05:28 | ad-hoc-news.de
Suess Microtec has introduced the XBC300 Gen2 wafer bonder to address surging demand in advanced packaging and 3D integration, aiming squarely at high-volume semiconductor production rather than lab-scale tools.
Suess Microtec, DE000A1K0235
Edited
2026-06-16
ourworldindata.org
2026-06-16
Our World in Data
Spending on the hardware that trains and runs artificial intelligence has grown rapidly over the past years. One of the clearest indicators of how rapidly spending has increased is the revenue of American chipmaker NVIDIA.
The company accounts for around 85% of the global market for AI chips. These are graphics processing units (GPUs), originally built for video games but well-suited to the paral
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.