Semiconductor News & Analysis Feed
3087 articles
2026-06-16
www.uidaho.edu
2026-06-16
University of Idaho
BY CHRIS COOK, U OF I EXECUTIVE DIRECTOR OF ADMISSIONS AND RECRUITMENT & FENG LI, MICRON ENDOWED PROFESSOR IN MICROELECTRONICS AND NGEM DIRECTOR
Semiconductors are no longer a niche corner of the tech economy. They are essential infrastructure. Microchips made from semiconductor materials power artificial intelligence, national defense systems, advanced manufacturing, transportation networks, ene
2026-06-16
www.tradingkey.com
2026-06-16
TradingKey
TSMC is collaborating with Ibiden and Innolux to validate glass substrates for its new CoPoS advanced packaging technology. This shift from wafer-level to panel-level processing aims to overcome limitations of traditional organic and silicon interposers. Simulation results indicate glass substrates offer significant improvements in warpage, thermal expansion, elastic modulus, power integrity, and
2026-06-16
news.google.com
2026-06-16
EE Times Asia
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
Infineon, DE0006231004
New AI power push: Infineon’s XDP700 digital multiphase controllers target Nvidia MGX servers
16.06.2026 - 03:15:46 | ad-hoc-news.de
Infineon is sharpening its AI hardware focus with the XDP700 family of digital multiphase controllers, designed to deliver efficient, tightly regulated power to GPUs and accelerators in next-generation Nvidia MGX AI server platforms.
Infineon
2026-06-16
ourworldindata.org
2026-06-16
Our World in Data
Spending on the hardware that trains and runs artificial intelligence has grown rapidly over the past years. One of the clearest indicators of how rapidly spending has increased is the revenue of American chipmaker NVIDIA.
The company accounts for around 85% of the global market for AI chips. These are graphics processing units (GPUs), originally built for video games but well-suited to the paral
2026-06-16
www.ad-hoc-news.de
2026-06-16
AD HOC NEWS
TSMC, TW0002330008
Capacity push for AI: TSMC’s CoWoS packaging ramps toward 140,000 wafers a month
16.06.2026 - 02:00:19 | ad-hoc-news.de
TSMC’s CoWoS advanced packaging line is emerging as a quiet workhorse of the AI boom. Industry data now points to capacity as high as 120,000 to 140,000 wafers per month by 2026, as the Taiwanese foundry pours billions into a technology that has become critica
2026-06-16
digitimes.com
2026-06-16
Qualcomm has been in talks to acquire Tenstorrent, an AI chip startup, The Informationreported, citing a person with direct knowledge of the deal. The two companies have discussed a price of US$8 billion to US$10 billion, the person said, a significant premium to Tenstorrent's last known valuation.
2026-06-16
digitimes.com
2026-06-16
SK Hynix moved closer to shipping seventh-generation high-bandwidth memory, HBM4E, to key customers as timing emerged as a critical competitive factor in the global memory market. According to Newsis, industry sources reported that SK Hynix had recently made positive progress in HBM4E development and was preparing to send samples soon, with shipments possibly beginning in June 2026 and no later th
2026-06-16
digitimes.com
2026-06-16
Japan's Rapidus has signed a memorandum of understanding with the UK Semiconductor Centre, a government-backed body established in 2025 to support Britain's semiconductor ecosystem, marking a step toward cooperation on future semiconductor manufacturing and potential customer development in the UK, according to Rapidus and reports from Nikkei, Bloomberg,and Reuters.
2026-06-16
digitimes.com
2026-06-16
Researchers and chipmakers presented new logic, memory, and device architectures at the 2026 IEEE/JSAP VLSI Technology and Circuits Symposium in Honolulu, with several results pointing toward pilot production and mass manufacturing.
2026-06-16
digitimes.com
2026-06-16
Austria's AT&S plans to invest up to EUR2 billion (approx. US$2.32 billion) to expand its Kulim plant and a previously unused building at the second site in Kulim, Malaysia, as part of a broader push to capitalize on AI demand. The company said the investments will be fully supported and financed by long-term customer commitments, and it expects to represent at least five leading US tech partners.
2026-06-16
digitimes.com
2026-06-16
The semiconductor supply chain is facing another raw material shock — this time from tungsten hexafluoride, or WF6, a specialty gas used in chip manufacturing. Planned production adjustments or exits by some Japanese suppliers in the second half of 2026 have intensified concerns over tighter global supply, sending prices sharply higher and raising the risk of disruption into 2027.
2026-06-16
digitimes.com
2026-06-16
China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity for the second half of the year. But supply chain players say the long-term priority is still to expand substrate capacity from non-China sources, with supply security for the AI industry outweighing price.
2026-06-16
digitimes.com
2026-06-16
The AI data center buildout is driving demand for high-performance computing (HPC) and networking chips, sending the global IC substrate industry into a new growth cycle. Order visibility now extends two to three years, prompting Taiwan's three leading IC substrate suppliers,Unimicron,Kinsus, andNanya PCB, to restart capacity expansion targeting GPU, CPU, and ASIC customers.
2026-06-16
digitimes.com
2026-06-16
AI, high-performance computing, and early pull-ins from TV, PC, and notebook supply chains pushed the global foundry market to a record high in the first quarter of 2026. China's Nexchip Semiconductor delivered the key ranking shift, overtaking Taiwan's Vanguard International Semiconductor (VIS) for the first time to become the world's eighth-largest foundry.
2026-06-16
digitimes.com
2026-06-16
AMD said it will acquire MEXT, a move aimed at strengthening its AI and data center portfolio amid rising global memory demand. The deal is intended to help customers improve performance, reduce infrastructure costs, and accelerate the deployment of AI, analytics, and high-performance workloads across cloud and enterprise systems.
2026-06-16
digitimes.com
2026-06-16
Apple is stepping up the AI capabilities of its Siri voice assistant, and analysts say memory chip demand will rise along with it, potentially benefiting Apple's suppliers such as Samsung Electronics and SK Hynix. The shift could drive both shipment growth and higher prices for mobile DRAM.
2026-06-16
digitimes.com
2026-06-16
China has achieved mass production of ultra-pure silicon, according to the state-owned China National Nuclear Corporation (CNNC) — an essential material for building silicon-based quantum computers. The breakthrough builds on a government push to sharpen its quantum research edge and reduce its reliance on foreign technology supply chains more broadly.
2026-06-16
eetimes.com
2026-06-16
Pablo Valerio
Researchers at the University of São Paulo use RISC-V to build the Internet of Trees, a real-time monitoring network for the Amazon rainforest.
2026-06-16
digitimes.com
2026-06-16
ASML, TSMC, and imec have demonstrated a major advance in the effort to bring two-dimensional (2D) semiconductor materials from research laboratories into high-volume semiconductor manufacturing. At the 2026 IEEE/JSAP Symposium on VLSI Technology and Circuits, the partners unveiled a 300mm wafer integration flow that produced both n-type and p-type 2D-material transistors at a 50nm contacted poly